{"title":"An Efficient and Fast 112Gbps/PAM4 Signal Line Design with Conventional FCBGA Substrate Based on a 3-D Component Library","authors":"R. Oikawa","doi":"10.1109/ectc32862.2020.00156","DOIUrl":null,"url":null,"abstract":"This paper proposes and demonstrates a component library-based design that reduces 112Gbps signal design lead-time of LSI product package from months to several days with keeping design robustness against fabrication process deviation, as well as offering three-dimensional (3-D) electromagnetic (EM) simulation accuracy.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"25 1","pages":"956-963"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc32862.2020.00156","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
This paper proposes and demonstrates a component library-based design that reduces 112Gbps signal design lead-time of LSI product package from months to several days with keeping design robustness against fabrication process deviation, as well as offering three-dimensional (3-D) electromagnetic (EM) simulation accuracy.
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