High aspect ratio nano-scale CFX structures fabricated by deep-rie

T. Arakawa, H. Kusakawa, S. Shoji
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引用次数: 1

Abstract

High aspect ratio (>500) nano-scale CFx (fluorocarbon) "tube" and "test-tube" arrays were realized using Deep Reactive Ion Etching (RIE). Sidewall CFx nano structures of 200 nm in thickness formed during Deep RIE passivation process were used for the purpose. The film thickness of CFx was controlled from 200 nm to 500 nm, and the height more than 100 mum was available. As a result, the aspect ratio is larger than 500. This fluorocarbon tube and test-tube array are useful tools for chemical and biological applications.
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用deep-rie制备高纵横比纳米级CFX结构
高纵横比(bbb500)纳米级CFx(氟碳)“管”阵列和“试管”阵列采用深反应离子蚀刻(RIE)技术实现。采用Deep RIE钝化工艺形成的厚度为200 nm的侧壁CFx纳米结构。CFx的膜厚控制在200 ~ 500 nm,膜高可达100 nm以上。因此,宽高比大于500。这种氟碳管和试管阵列是化学和生物应用的有用工具。
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