New fabrication method for high frequency InP/InGaAsP buried heterostructure semiconductor lasers

R. Holmstrom, E. Meland, J. Schlafer, W. Powazinik
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Abstract

A process that permits the controllable fabrication of buried heterostructure (BH) lasers with <1.0 mu m wide active layers and 0.1-0.2 mu m of lateral cladding and achieves the high photon densities and low parasitics necessary for high resonance frequency and modulation bandwidth lasers is described. The process may be used with bulk heterostructure, quantum well, and distributed feedback (DFB) grated structures. Control of critical dimensions to +or-0.1 mu m can be realized using the process. The process development for fabrication of a 1.3 mu m or 1.5 mu m wavelength high frequency laser is discussed.<>
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高频InP/InGaAsP埋置异质结构半导体激光器的新制备方法
一种允许可控制造埋藏异质结构(BH)激光器的工艺
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Effect of structural parameters on InGaAs/InAlAs 2DEG characteristics High speed InGaAs HBT devices and circuits High performance diffused InGaAs JFETs in OEICs Current-controlled liquid phase epitaxy of InAsP on InP substrates High power and high temperature operation of 1.5 mu m wavelength strained-layer InGaAs/InGaAsP SIPBH lasers
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