Electromigration simulation and design considerations for integrated circuit power grids

F. Najm, V. Sukharev
{"title":"Electromigration simulation and design considerations for integrated circuit power grids","authors":"F. Najm, V. Sukharev","doi":"10.1116/6.0000476","DOIUrl":null,"url":null,"abstract":"Due to continued technology scaling, electromigration has become a serious reliability concern in modern integrated circuits. This is further aggravated by the pervasive use of inaccurate models for electromigration based on traditional empirical black-box models. We will review the modern approach to electromigration verification, with emphasis on recent physical models, then summarize our work on a finite-difference based approach for power grid electromigration checking using these models. The method simulates the electromigration damage across the power grid, much like simulating for voltage or current. The lifetimes found using this physics-based approach are on average about twice or more than those based on the traditional empirical approaches. Because this approach is computationally efficient, one is able to handle large grids with millions of branches. We then present detailed analysis of the steady-state stress and its relation to voltages and currents in the grid, along with a number of design considerations that follow from this analysis.","PeriodicalId":17652,"journal":{"name":"Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2020-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1116/6.0000476","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

Due to continued technology scaling, electromigration has become a serious reliability concern in modern integrated circuits. This is further aggravated by the pervasive use of inaccurate models for electromigration based on traditional empirical black-box models. We will review the modern approach to electromigration verification, with emphasis on recent physical models, then summarize our work on a finite-difference based approach for power grid electromigration checking using these models. The method simulates the electromigration damage across the power grid, much like simulating for voltage or current. The lifetimes found using this physics-based approach are on average about twice or more than those based on the traditional empirical approaches. Because this approach is computationally efficient, one is able to handle large grids with millions of branches. We then present detailed analysis of the steady-state stress and its relation to voltages and currents in the grid, along with a number of design considerations that follow from this analysis.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
集成电路电网的电迁移仿真及设计考虑
由于技术的不断扩展,电迁移已经成为现代集成电路中一个严重的可靠性问题。普遍使用基于传统经验黑箱模型的不准确电迁移模型进一步加剧了这一点。我们将回顾电迁移验证的现代方法,重点是最近的物理模型,然后总结我们在使用这些模型进行电网电迁移检查的基于有限差分的方法上的工作。该方法模拟了跨电网的电迁移损伤,就像模拟电压或电流一样。使用这种基于物理的方法发现的寿命平均大约是基于传统经验方法的两倍或更多。由于这种方法具有计算效率,因此可以处理具有数百万分支的大型网格。然后,我们详细分析了稳态应力及其与电网中电压和电流的关系,以及由此分析得出的一些设计考虑。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Tunable and scalable fabrication of plasmonic dimer arrays with sub-10 nm nanogaps by area-selective atomic layer deposition Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies Ultradeep microaxicons in lithium niobate by focused Xe ion beam milling Self-powered ultraviolet photodiode based on lateral polarity structure GaN films Electrical conductivity across the alumina support layer following carbon nanotube growth
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1