Tin Whiskers 101: 2019

Ronald C. Lasky, A. Balch
{"title":"Tin Whiskers 101: 2019","authors":"Ronald C. Lasky, A. Balch","doi":"10.23919/PANPACIFIC.2019.8696615","DOIUrl":null,"url":null,"abstract":"Tin whiskers continue to be a major concern in electronics assembly. This paper will firstly give an explanation of tin whiskers and their formation. Secondly, it will summarize their potential risks and mitigation techniques. A description of Failure Modes and Effects Analysis (FMEA) as a technique to assess tin whisker risk, for a given technology, will be then be discussed.This paper will conclude with a discussion of tin whisker reliability strategies for consumer and mission critical products. At the end of the presentation, attendees will have all of the basic relevant information to develop an effective tin whisker strategy.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"135 1","pages":"1-14"},"PeriodicalIF":0.0000,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/PANPACIFIC.2019.8696615","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Tin whiskers continue to be a major concern in electronics assembly. This paper will firstly give an explanation of tin whiskers and their formation. Secondly, it will summarize their potential risks and mitigation techniques. A description of Failure Modes and Effects Analysis (FMEA) as a technique to assess tin whisker risk, for a given technology, will be then be discussed.This paper will conclude with a discussion of tin whisker reliability strategies for consumer and mission critical products. At the end of the presentation, attendees will have all of the basic relevant information to develop an effective tin whisker strategy.
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锡须101:2019
锡晶须仍然是电子组装中的一个主要问题。本文首先对锡晶须及其形成进行了解释。其次,总结它们的潜在风险和缓解技术。然后将讨论失效模式和影响分析(FMEA)作为评估给定技术锡晶须风险的技术的描述。本文最后将讨论用于消费者和关键任务产品的锡晶须可靠性策略。在演讲结束时,与会者将获得所有基本相关信息,以制定有效的锡晶须策略。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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