Pub Date : 2019-04-22DOI: 10.23919/PANPACIFIC.2019.8696587
T. Kasahara, H. Kuwae, J. Mizuno
Micro and nanofabrication processes have significant impact on the recent development of semiconductor integrated circuits, micro/nano-electromechanical systems (MEMS/NEMS), biosensors, and optoelectronic devices. In addition, several semiconductor wafer bonding and two point five-dimensional (2.5D)/three-dimensional (3D) integration technologies have been proposed in order to develop advanced electronic device applications. On the other hand, organic electronic devices, which consist of organic semiconducting materials instead of traditional inorganic materials such as silicon, have attracted attention for applications in flexible devices, wearable devices, and others. In particular, organic light-emitting diodes (OLEDs) have recently reached the stage of commercialization of new light sources and flat-panel displays. Our research group have focused on studies on novel inorganic and organic electronic devices. This presentation provides a brief overview of the authors’ own recent researches on nanofabrications, homogeneous and heterogeneous bonding technologies, and functional microdevices. We especially discuss our organic electroluminescent device applications such as the nano-OLEDs and the microfluidic OLEDs.
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Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696855
Y. Morikawa
Smart ICT (Information and Communication Technology) such as “Big Data”, “Cloud computing” and Smart Functionalities such as}Stand-alone Self-activating MEMS/Sensors construct Smart Systems which enable IoT (Internet of Things), IoE (Internet of Everything) thus Smart Society. High-density Packaging technologies such as 3D, 2.5D packaging scheme basing on TSV (through-Si via) technology and PWB (printed wiring board) packaging as high-density interposer are among key technologies to satisfy the requirements from the both smart semiconductor devices for AI (artificial intelligence), and smart functional devices for “Edge-computing”. Meanwhile MEMS/Sensors are required as multi-functionalities of stand-alone smart devices for wearable devices including smart phone, an important part of smart-systems. Thus, the demand of high density FO-SiP (fan-out system in packaging) is growing. In order to accomplish high-density packaging as homogeneous and heterogeneous integration, miniaturization of wiring in organic package is needful to MCM (multi chip module) system fabrication on the PWB. To obtain vias in a build-up film, the laser drilling process is widely used but there are three major restricting difficulties. The first is that it is difficult to make fine vias and line / space because of laser wave length limitation. The second is that wet desmear process to remove smear for each generation’s build-up films is also will be issue by swelling and silica-residue problem. And finally, such kind of technologies cannot intentionally control of surface roughness for build-up film. In this study, a fine via and line and space patterns processing below $10 mu mathrm{m}$ with low surface-roughness in a low-CTE (coefficient of thermal expansion) Build-up film was achieved by using a plasma dry process. That technology applications are dry desmear and dry etching for fan-out wiring fabrication.
“大数据”、“云计算”等智能ICT(信息通信技术)和独立自激活MEMS/传感器等智能功能构建了智能系统，使IoT(物联网)、IoE(万物互联)成为智能社会。高密度封装技术，如基于TSV (through-Si via)技术的3D、2.5D封装方案和作为高密度中间层的PWB (printed wiring board)封装，是满足AI(人工智能)智能半导体器件和“边缘计算”智能功能器件需求的关键技术之一。同时，包括智能手机在内的可穿戴设备作为智能系统的重要组成部分，需要MEMS/传感器作为单机智能设备的多功能。因此，对高密度FO-SiP(封装中的扇出系统)的需求正在增长。为了实现均匀集成和异构集成的高密度封装，在pcb上制造MCM(多芯片模块)系统需要实现有机封装中布线的小型化。为了在堆积膜中获得通孔，激光打孔工艺得到了广泛的应用，但存在三个主要的限制困难。首先，由于激光波长的限制，难以制作精细的通孔和线/空间。其次是湿式除污工艺，对于每一代的涂膜堆积也是会出现膨胀和硅渣问题的。最后，这种技术不能有意地控制堆积膜的表面粗糙度。在这项研究中，通过使用等离子体干燥工艺，在低cte(热膨胀系数)堆积膜中实现了低于$10 mu mathm {m}$的精细通孔、线和空间图案加工，表面粗糙度低。该技术应用于扇形布线的干涂和干蚀刻。
{"title":"Advanced Package Wiring Technology Solution for Heterogeneous Integration","authors":"Y. Morikawa","doi":"10.23919/PANPACIFIC.2019.8696855","DOIUrl":"https://doi.org/10.23919/PANPACIFIC.2019.8696855","url":null,"abstract":"Smart ICT (Information and Communication Technology) such as “Big Data”, “Cloud computing” and Smart Functionalities such as}Stand-alone Self-activating MEMS/Sensors construct Smart Systems which enable IoT (Internet of Things), IoE (Internet of Everything) thus Smart Society. High-density Packaging technologies such as 3D, 2.5D packaging scheme basing on TSV (through-Si via) technology and PWB (printed wiring board) packaging as high-density interposer are among key technologies to satisfy the requirements from the both smart semiconductor devices for AI (artificial intelligence), and smart functional devices for “Edge-computing”. Meanwhile MEMS/Sensors are required as multi-functionalities of stand-alone smart devices for wearable devices including smart phone, an important part of smart-systems. Thus, the demand of high density FO-SiP (fan-out system in packaging) is growing. In order to accomplish high-density packaging as homogeneous and heterogeneous integration, miniaturization of wiring in organic package is needful to MCM (multi chip module) system fabrication on the PWB. To obtain vias in a build-up film, the laser drilling process is widely used but there are three major restricting difficulties. The first is that it is difficult to make fine vias and line / space because of laser wave length limitation. The second is that wet desmear process to remove smear for each generation’s build-up films is also will be issue by swelling and silica-residue problem. And finally, such kind of technologies cannot intentionally control of surface roughness for build-up film. In this study, a fine via and line and space patterns processing below $10 mu mathrm{m}$ with low surface-roughness in a low-CTE (coefficient of thermal expansion) Build-up film was achieved by using a plasma dry process. That technology applications are dry desmear and dry etching for fan-out wiring fabrication.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"121 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86854394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696750
O. Aina, K. Verma
Organizations in the 21st century require managers who possess the ability to create employee satisfaction through the right leadership style. Boleslaw (2009) observed that some senior managers believe leadership is about power-holding to manipulate and control the employees. Such leadership style may cause employees’ dissatisfaction with their jobs and affect the performance of organizations operating in the competitive business environment. A quantitative correlational research study was conducted to investigate the relationship between leadership style of the senior managers and job satisfaction and commitment of the middle managers working at the corporate headquarters of a communications company in Atlanta, Georgia, USA. In the research study, 166 middle managers of the organization were involved. The middle managers implement organizational strategies, oversee departments within the organization, and report to their respective senior managers. The senior managers included the chief executive officers and the division heads who create strategies for the middle managers to implement. The independent variable examined in the quantitative correlational research study was the leadership style of the senior managers measured with the attributes of transformational, transactional, and laissez-faire leadership styles. The dependent variable was the job satisfaction of the middle managers and their commitment to the organization. The research instruments used to collect data for the current research study were the MLQ Rater Form 5X-Short to investigate leadership style, Job in General Survey (JIG) instrument to evaluate job satisfaction and Organizational Commitment Questionnaire (OCQ) to measure employee commitment to their organization. A demographic questionnaire was developed for the research study to describe the participants and analyze sub-groups of the participants. The statistical analysis SPSS Version 20.0 was used to collate data and calculate descriptive statistics such as mean, standard deviation, minimum, and maximum for each leadership style and overall job satisfaction. Descriptive statistics, Pearson correlation coefficient, the analysis of variance (ANOVA), and multiple regression analysis were used for the data analysis. Analysis of the data found that transformational leadership style has a positive correlation on employee job satisfaction and employee commitment. A higher level of job satisfaction and employee commitment for employees who had managers who exhibited transformational leadership was observed. Analysis of the demographic variables found that demographic variables moderated the relationship between leadership style of the senior managers and job satisfaction of the middle managers. The study found that employees, most especially, middle managers of communications industry preferred their senior managers to exhibit more of transformational leadership features, less of transactional leadership, and little or no of lais
21世纪的组织需要管理者拥有通过正确的领导风格创造员工满意度的能力。Boleslaw(2009)观察到一些高级管理人员认为领导就是掌握权力来操纵和控制员工。这种领导风格可能会引起员工对工作的不满，并影响在竞争激烈的商业环境中运作的组织的绩效。本研究以美国乔治亚州亚特兰大市某通讯公司总部为研究对象，对高层管理人员的领导风格与中层管理人员的工作满意度和工作承诺之间的关系进行了定量的相关研究。在本研究中，共涉及该组织的166名中层管理人员。中层管理人员执行组织战略，监督组织内的部门，并向各自的高级管理人员报告。高级管理人员包括首席执行官和部门负责人，他们为中层管理人员制定实施战略。定量相关研究中考察的自变量是高层管理人员的领导风格，以变革型、交易型和自由放任型领导风格的属性来衡量。因变量为中层管理人员的工作满意度及其对组织的承诺。本研究收集数据的研究工具有:调查领导风格的MLQ评分表5X-Short、评估工作满意度的工作综合调查量表(Job in General Survey, JIG)和衡量员工对组织承诺的组织承诺问卷(Organizational Commitment Questionnaire, OCQ)。人口调查问卷是为研究开发的，以描述参与者和分析参与者的子群体。统计分析采用SPSS Version 20.0对数据进行整理，计算各领导风格和整体工作满意度的均值、标准差、最小值、最大值等描述性统计。数据分析采用描述性统计、Pearson相关系数、方差分析和多元回归分析。数据分析发现，变革型领导风格对员工工作满意度和员工承诺有正相关关系。我们观察到，拥有变革型领导的管理者的员工，其工作满意度和员工承诺水平更高。对人口统计变量的分析发现，人口统计变量对高层管理人员领导风格与中层管理人员工作满意度的关系有调节作用。研究发现，通信行业的员工，尤其是中层管理人员，更希望他们的高级管理人员表现出更多的变革型领导特征，较少的交易型领导特征，很少或没有自由放任型领导风格。因此，组织领导者可以利用定量相关研究的结果来促进组织中的积极变化，如提高工作满意度、组织承诺、目标统一和组织公民行为(ocb)。
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Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696372
A. Fontanelli, M. Taliercio, F. Rossi
We are at the dawn of the fourth industrial revolution – also known as “Industry 4.0”, which demands for even more integrated, heterogeneous electronic systems. “Systems 4.0” are actually a prerequisite for the Industry 4.0 to happen. The ability to dramatically slash the footprint, and the power envelope of increasingly complex, highly heterogeneous electronic systems is critical, and can be achieved only through their “siliconization”, i.e. moving from board-level integration to chip-level integration – 2.5D, 3D, and 5.5.D – with multiple silicon components either stacked on top of one another, or placed side-by-side onto a silicon interposer, or hybrid combinations of the previous solutions. The “communication” – I/O – among the compute, memory, interface, sense, actuate components of Systems 4.0 is going to play a fundamental role in the feasibility itself of Systems 4.0: I/O takes a 50% toll on the total power envelope of the systems, and has become a blockage towards higher bandwidth (performance). From the electronics perspective, these developments will be enabled by a series of innovations in the design and production chain of integrated circuits. The characteristics and heterogeneity of advanced systems and also the exponential growth of the I/O number, call for the development of I/O optimization algorithms, taming the computational complexity of the 2.5D and 3D-IC designs. Also, this technology demands for a heterogeneous co-design environment, integrated with traditional Package and IC Design Tools via standard formats, in order to design with a streamline flow.
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Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696621
M. Bixenman, Mark McMeen
OEMs (Original Equipment Manufacturers) and EMSs (Electronic Manufacturing Services) work to a set of guidelines and test procedures for qualification of hardware when changing soldering materials, process conditions, cleaning materials, cleaning machines, and conformal coating. Evaluation and use of any soldering material, reflow setting, or cleaning material, the EMS shall confirm that the proposed materials are characterized and qualified to the applicable ANSI/IPC Industry Standards. Additionally, IPCJ-STD-001G, Amendment 1 issued changes to Cleanliness Standards requiring the assembler to develop objective evidence that a specific cleanliness condition renders a reliable device.For many PCB designs with complex component geometries, cleanliness can impact reliability and circuit performance. The gold standard for circuit qualification has been to pass SIR (Surface Insulation Resistance) testing with resistivity values that show that the design and process do not interfere with the circuit performance. Up until now, SIR testing hasn’t been practical on the manufacturing floor as the test traditionally takes seven days to complete, and requires equipment that is complicated to use. The purpose of this research is to design instrumentation and test methods that allow both the OEM and EMS to perform process development and process control using electrical test methods for use in an operations environment.The research study centers on “On-going Reliability Testing” that allows the assembler to take testing to the technician level. Using a combination of modern, configurable test cards that scrutinize high-risk circuits and devices integrated on the assembly, the EMS can correlate cleanliness to production hardware. This bottom-up testing methodology allows the assembler to repeat IPC testing in their factory – objective evidence to J-STD-001G, Amendment 1. Also, they can expand testing to other areas such as system design, process development, process control, and quality assurance.
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Pub Date : 2019-02-01DOI: 10.23919/PanPacific.2019.8696677
John Cooper
Consumer products have been thought of as being low priced and unreliable. We will look at some of the best approaches to use in designing and manufacturing consumer products in regard to reliability, and how these approaches can result in improved profitability without increasing cost, and some aspects of implementing these approaches. The approaches discussed here can be adapted to the special needs of small companies and startups. The intended audience here is the reliability engineer or technical manager in a small company or startup, involved in hardware product development for the consumer market. This material is aimed at those people or companies who actively care to make their products better and are willing to consider various approaches that may be within their budget. Many of the techniques involved with making consumer products more reliable are common to reliability tools used for higher end products of any quality level or cost level. Analytical tools, such as FMEA (Failure Mode Effects Analysis), or HALT (Highly Accelerated Life Testing) are very useful for improving the reliability of consumer products. In this paper, we will look at some aspects of how consumer products differ from industrial products, and what special concerns there are with product reliability; we’ll discuss Strengths, Weaknesses, Opportunities and Threats (SWOT) and how they relate to consumer products reliability. We will discuss how reliability tools and methods for consumer products differ from higher end products, what tools are practical, and how some other aspects of consumer product quality and reliability differ. The special needs of the small company or startup will be considered, showing what reliability methods are more practical.
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Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696281
N. Nagaraj
Effective supply chain communication is of paramount importance in todays world, more so than ever. This is because of the greater disclosure, notification and safe use information dissemination needs placed on every part or article placed on the market. The fact that the extended supply chain is often more than sixteen layers deep and spanned across all continents and oceans makes it even more complex. When one considers the cross-sector supply chain and the nature and scope of materials and substances involved, one begins to see the extent of the complexity. Added to this, is the fact that in various parts of the world, the language requirements will be different. Yet, when a product is placed on the market in those areas, the regulatory regime will require that critical compositions and safe usage be posted in local languages and/or in visually understandable pictures and representations/images/videos. The underlying data that must be communicated is often of myriads of forms, including spreadsheets, structured data and also unstructured data and images and videos. It is also important to consider that supply chain data must have the following characteristics:1.It must be standards based.2.By nature, multiple language and character sets are to be allowed.3.It must be authenticatable-both provenance and the data integrity are important.4.The process for updates must allow for synchronization across the various levels of the supply chain/5.The cost burden must not be high. By its nature, supply chain data must cost as minimal as possible to promote cost effectiveness and keep overhead cost to a minimum. This is especially true for programs involving corporate responsibility (CSR) as these actions are a show of ethical behavior on the part of corporations, and thus profoundly, companies promoting ethical behavior must not be burdened with costs, as otherwise it will give the scofflaws and nonconformers of CSR an edge in business.6.Safe use data can often be in video format and thus very large in size-it may be advantageous to provide these as web links rather than attach them. It is to be noted that videos on safe use will alleviate the need for instructions to be translated into multiple languages.7.Zipping attachments is more efficient than embedding binary data in files and files could be bulky and the large files need not always be opened whereas the base file will invariably need to be read.8.Monopolistic practices should be avoided and prevented.A platform that optimizes all these needs across multiple clouds and cloud database formats was developed and best management practices reveal the advantages of such an approach.
{"title":"A Hybrid Multicloud System for Effective Supply Chain Product Information Dissemination","authors":"N. Nagaraj","doi":"10.23919/PANPACIFIC.2019.8696281","DOIUrl":"https://doi.org/10.23919/PANPACIFIC.2019.8696281","url":null,"abstract":"Effective supply chain communication is of paramount importance in todays world, more so than ever. This is because of the greater disclosure, notification and safe use information dissemination needs placed on every part or article placed on the market. The fact that the extended supply chain is often more than sixteen layers deep and spanned across all continents and oceans makes it even more complex. When one considers the cross-sector supply chain and the nature and scope of materials and substances involved, one begins to see the extent of the complexity. Added to this, is the fact that in various parts of the world, the language requirements will be different. Yet, when a product is placed on the market in those areas, the regulatory regime will require that critical compositions and safe usage be posted in local languages and/or in visually understandable pictures and representations/images/videos. The underlying data that must be communicated is often of myriads of forms, including spreadsheets, structured data and also unstructured data and images and videos. It is also important to consider that supply chain data must have the following characteristics:1.It must be standards based.2.By nature, multiple language and character sets are to be allowed.3.It must be authenticatable-both provenance and the data integrity are important.4.The process for updates must allow for synchronization across the various levels of the supply chain/5.The cost burden must not be high. By its nature, supply chain data must cost as minimal as possible to promote cost effectiveness and keep overhead cost to a minimum. This is especially true for programs involving corporate responsibility (CSR) as these actions are a show of ethical behavior on the part of corporations, and thus profoundly, companies promoting ethical behavior must not be burdened with costs, as otherwise it will give the scofflaws and nonconformers of CSR an edge in business.6.Safe use data can often be in video format and thus very large in size-it may be advantageous to provide these as web links rather than attach them. It is to be noted that videos on safe use will alleviate the need for instructions to be translated into multiple languages.7.Zipping attachments is more efficient than embedding binary data in files and files could be bulky and the large files need not always be opened whereas the base file will invariably need to be read.8.Monopolistic practices should be avoided and prevented.A platform that optimizes all these needs across multiple clouds and cloud database formats was developed and best management practices reveal the advantages of such an approach.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"68 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85210717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696655
R. Vaga, Keith Bryant
This advanced technical solution combines the strongest in line inspection technology, which is 3D AOI with At-Line X-ray technology, giving Real Process Management.But as so often it is not so easy to turn it into reality, it requires a real commitment from different companies with differing software platforms and methods of operation. Let’s look at the issues of achieving Real Process Management; In-line X-Ray has some challenges in this environment due to False Fails and Escapes, in short if you do not have accurate data you cannot achieve improvement easily or cost effectively. So, we promote 3D AOI as a faster, more technically advanced solution, but even these systems have an Achilles Heel, they cannot inspect joints on Bottom Terminated Components (BGA’s, CSP’s, QFN’s etc.) As they have only vision and height measurement, they can measure flatness and co planarity very well, but as in line x-ray they have to make a decision based on assumptions. Or at least that was the issue until now, when a technology is available to link 3D in-line AOI to At-Line X-Ray, allowing a decision to be made based on information from both systems, indeed SPI results and Pre-Reflow AOI results can also be considered.The technology works like this: any height measurement of a BTC which the in-line 3D AOI “fails” is relayed to the At-Line X-ray and evaluated by its operator using all the technology at his disposal including ICT which gives a detailed view of all hidden joint interfaces.The results and images are then fed to a Management Information System where a technician can review the SPI data, the 3D AOI data and the x-ray results, in real time on the same monitor. He can now use his judgment to accept or fail the board, can review historic data trends to fine-tune the AOI height limits and continuously improve the process by Intelligent Feedback. The use of a brain to filter the algorithms and images to ensure maximized yields, reduced rework and lower costs. This data can then be archived and shared with other lines, other factories or even with customers.Reports can be made available to senior managers and customers showing the results of this Process Management, which is improved yields and reduced rework. In short, a process fully under control and utilizing the application of knowledge, tools and systems to measure, control, report and improve processes with the goal to meet the customer requirements profitably.
{"title":"Industry 4.0 for Advanced Inspection","authors":"R. Vaga, Keith Bryant","doi":"10.23919/PANPACIFIC.2019.8696655","DOIUrl":"https://doi.org/10.23919/PANPACIFIC.2019.8696655","url":null,"abstract":"This advanced technical solution combines the strongest in line inspection technology, which is 3D AOI with At-Line X-ray technology, giving Real Process Management.But as so often it is not so easy to turn it into reality, it requires a real commitment from different companies with differing software platforms and methods of operation. Let’s look at the issues of achieving Real Process Management; In-line X-Ray has some challenges in this environment due to False Fails and Escapes, in short if you do not have accurate data you cannot achieve improvement easily or cost effectively. So, we promote 3D AOI as a faster, more technically advanced solution, but even these systems have an Achilles Heel, they cannot inspect joints on Bottom Terminated Components (BGA’s, CSP’s, QFN’s etc.) As they have only vision and height measurement, they can measure flatness and co planarity very well, but as in line x-ray they have to make a decision based on assumptions. Or at least that was the issue until now, when a technology is available to link 3D in-line AOI to At-Line X-Ray, allowing a decision to be made based on information from both systems, indeed SPI results and Pre-Reflow AOI results can also be considered.The technology works like this: any height measurement of a BTC which the in-line 3D AOI “fails” is relayed to the At-Line X-ray and evaluated by its operator using all the technology at his disposal including ICT which gives a detailed view of all hidden joint interfaces.The results and images are then fed to a Management Information System where a technician can review the SPI data, the 3D AOI data and the x-ray results, in real time on the same monitor. He can now use his judgment to accept or fail the board, can review historic data trends to fine-tune the AOI height limits and continuously improve the process by Intelligent Feedback. The use of a brain to filter the algorithms and images to ensure maximized yields, reduced rework and lower costs. This data can then be archived and shared with other lines, other factories or even with customers.Reports can be made available to senior managers and customers showing the results of this Process Management, which is improved yields and reduced rework. In short, a process fully under control and utilizing the application of knowledge, tools and systems to measure, control, report and improve processes with the goal to meet the customer requirements profitably.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"60 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82035696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696414
Phillip Isaacs, Mauricio Castro Gomez, Luis Kosonoy
In the electronics industry there is a drive to reduce the total cost of manufacturing, while maintaining the quality and reliability of the product. The drive for lower cost can have unanticipated consequences. One such consequence is that the Electronic Manufacturing Service (EMS) provider of the Printed Circuit Board Assembly (PCBA) and the System Assembly operations aren’t collocated. In fact, often they are in different countries and on different continents. In normal operation, the supply chain implications can be managed. However, when there are reasons to modify or repair the assembly, the distance between the EMS supplier and the System Assembly location can cause major disruption and expense.There are several factors which may cause undue disruption to the supply chain. For example:1.The PCBA’s are damaged while in route to the system assembly line.2.There is a product engineering change.3.The customer order has changed and the product needs to be reconfigured.4.There are manufacturing defects which were found during inspection or system test.Whatever the cause, sending the assemblies back to their original plant of manufacture can take too much time and may require costly premium transportation to mitigate the extra time for transportation not accounted for in the product schedule.It is for these reasons and more that the process was initiated to find a local supplier skilled in the art of mechanical and solder related reworks. The ultimate rework objective is to find a Rework Supplier who can rework the product achieving the same or high quality and reliability. This report will cover in more detail the motivation to establish a local rework supplier, the selection criteria and the qualification process.
{"title":"Selection and Qualification of a Local Rework Supplier","authors":"Phillip Isaacs, Mauricio Castro Gomez, Luis Kosonoy","doi":"10.23919/PANPACIFIC.2019.8696414","DOIUrl":"https://doi.org/10.23919/PANPACIFIC.2019.8696414","url":null,"abstract":"In the electronics industry there is a drive to reduce the total cost of manufacturing, while maintaining the quality and reliability of the product. The drive for lower cost can have unanticipated consequences. One such consequence is that the Electronic Manufacturing Service (EMS) provider of the Printed Circuit Board Assembly (PCBA) and the System Assembly operations aren’t collocated. In fact, often they are in different countries and on different continents. In normal operation, the supply chain implications can be managed. However, when there are reasons to modify or repair the assembly, the distance between the EMS supplier and the System Assembly location can cause major disruption and expense.There are several factors which may cause undue disruption to the supply chain. For example:1.The PCBA’s are damaged while in route to the system assembly line.2.There is a product engineering change.3.The customer order has changed and the product needs to be reconfigured.4.There are manufacturing defects which were found during inspection or system test.Whatever the cause, sending the assemblies back to their original plant of manufacture can take too much time and may require costly premium transportation to mitigate the extra time for transportation not accounted for in the product schedule.It is for these reasons and more that the process was initiated to find a local supplier skilled in the art of mechanical and solder related reworks. The ultimate rework objective is to find a Rework Supplier who can rework the product achieving the same or high quality and reliability. This report will cover in more detail the motivation to establish a local rework supplier, the selection criteria and the qualification process.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"14 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75145611","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696878
K. Paik
Due to the increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile and wearable electronic products, there have been growing needs of various electronic packaging products and fine-pitch interconnection technologies. To realize various state-of-art mobile and wearable electronic products, fine pitch and flexible packaging & interconnection technologies are needed. As one of the promising fine pitch and flexible packaging and interconnection technologies, conductive adhesive films materials such as ACFs(Anisotropic Conductive Films) and NCFs(Non Conductive Films) are widely used now.In general, ACFs have two technical limitations such as (1) ultra-fine pitch shortage free interconnection and (2) higher current handling capability. For (1) ultra-fine pitch applications without electrical shortage, new concept of Nano-fiber ACFs and APL(Anchoring Polymer Layer) ACFs have been successfully invented by KAIST both for less than 20 micron pitch COG(Chip On Glass), COP(Chip On Polymer). and COF(Chip On Flex). And they can be also used for less than 50 micron pitch FOF(Flex On Flex) and FOB(Flex On Board) applications. In addition, for (2) higher current handling capability applications, new solder ACFs have been also introduced by KAIST to replace the conventional metal particles based ACFs interconnection. By solder ACFs, 30% low contact resistance, 4 X higher current handling capability, and excellent reliability were successfully achieved compared with conventional ACFs. Furthermore, ACFs materials-based packaging and interconnection method can provide the flexible interconnect solution for OLED(Organic LED) COP and COF/CIF(Chip In Flex) packages to realize wearable electronic products.Recently the 3-D die chip stacking using the Through silicon via (TSV) technology has been widely used for stacking memory and ASIC chips. In the 3D-TSV vertical interconnection, Cu pillar/Sn-Ag eutectic solder bump is one of the promising bonding method. After the 3D-TSV chips are interconnected with the bumps, the gap between stacked chips should be filled with underfill materials. However, capillary flow underfill between 3D-TSV stacked chips become difficult because of increased chip/wafer area, decreased gap height, and multiple chip/wafer stacking. Therefore, new bonding method using NCFs materials, which performs both Cu-pillar/Sn-Ag flip chip bump to metal pads interconnection and underfils at the same time has been extensively used.In this presentation, the ACFs materials for ultra-fine pitch and higher current carrying interconnection and the NCFs for 3D-TSV chip stacking applications will be introduced.
由于移动和可穿戴电子产品对更高的性能、更大的灵活性、更小的尺寸和更轻的重量的需求不断增加，各种电子封装产品和细间距互连技术的需求不断增长。为了实现各种先进的移动和可穿戴电子产品，需要精细间距和柔性封装与互连技术。各向异性导电薄膜(ACFs)和非导电薄膜(nfc)等导电胶粘膜材料作为一种极具发展前景的细间距柔性封装和互连技术，目前得到了广泛的应用。一般来说，ACFs有两个技术限制，即(1)超细间距无短缺互连和(2)更高的电流处理能力。对于(1)无电短缺的超细间距应用，KAIST成功发明了纳米纤维ACFs和APL(锚定聚合物层)ACFs的新概念，两者均用于小于20微米间距的COG(Chip On Glass)， COP(Chip On Polymer)。和COF(Chip On Flex)。它们也可用于小于50微米间距的FOF(Flex On Flex)和FOB(Flex On Board)应用。此外，对于(2)更高电流处理能力的应用，KAIST还引入了新的焊料ACFs来取代传统的基于金属颗粒的ACFs互连。通过焊料ACFs，与传统ACFs相比，其接触电阻降低30%，电流处理能力提高4倍，可靠性优异。此外，ACFs基于材料的封装互连方法可以为OLED(Organic LED) COP和COF/CIF(Chip In Flex)封装提供柔性互连解决方案，实现可穿戴电子产品。近年来，采用透硅通孔(TSV)技术的三维芯片堆叠技术已广泛应用于存储芯片和ASIC芯片的堆叠。在3D-TSV垂直互连中，铜柱/Sn-Ag共晶凸点焊是一种很有前途的连接方法。3D-TSV芯片与凸起物互连后，堆叠芯片之间的间隙应用底料填充。然而，由于芯片/晶圆面积的增加、间隙高度的降低以及多个芯片/晶圆的堆叠，3D-TSV堆叠芯片之间的毛细管流动下填充变得困难。因此，利用nfc材料实现铜柱/Sn-Ag倒装芯片与金属衬垫互连并同时实现下填充的新型键合方法已得到广泛应用。本报告将介绍用于超细间距和高载流互连的ACFs材料以及用于3D-TSV芯片堆叠应用的nfc材料。
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