3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

Abstract

3D ultrasound imaging is becoming increasingly prevalent in the medical field. Compared to conventional 2D imaging systems, 3D imaging can provide a detailed view of tissue structures that makes diagnosis easier for the physicians. In addition, 2D image slices can be formed at various orientations to the transducer, making the examination less dependent on the skill of the sonographer. However, various challenges exist in developing a 3D imaging system, such as integration of a large number of elements, as well as post-processing of datasets received from a large number of channels. 2D transducer arrays are typically integrated with custom ICs in the probe handle to perform some intermediate beamforming and to reduce the number of cable connections to the imaging system. Capacitive micromachined ultrasonic transducers (CMUTs) have emerged as an alternative to piezoelectric transducers. Being a MEMS device, they greatly benefit from flexibility and ease of fabrication, and can be seamlessly integrated with electronics. Previous work demonstrates 3D stacking of CMUTs and dummy ICs with an intermediate interposer layer. However, that represents more of a mechanical demonstration of 3D integration. In this paper, we present a fully functional 3D ultrasound imaging system comprising a 32×32 2D CMUT array, 3D-stacked with front-end ICs using flip-chip bonding technology. The imaging system is capable of capturing real-time volumetric ultrasound data, and displaying 2D and 3D ultrasound images.