{"title":"Welcome message from Yi-Jen Chan, conference general chair","authors":"Y. Chan","doi":"10.1109/IMPACT.2009.5382152","DOIUrl":null,"url":null,"abstract":"Thanks for paying your attention on International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009), and I cordially welcome your participation of the conference.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"69 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382152","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Thanks for paying your attention on International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009), and I cordially welcome your participation of the conference.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
