{"title":"Issues in path toward low cost three-axis accelerometer for low-g application","authors":"Jen-Yi Chen, L. Liao, H. Chien, C. S. Lin, Y. Hsu","doi":"10.1109/IMPACT.2009.5382175","DOIUrl":null,"url":null,"abstract":"The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical parameters were optimized by theoretical calculation and fine tuned by finite-element-analysis (FEA) and integrated nodal simulation. Three spring-proof mass systems were integrated on a single structure in size of 1.3×1.28mm2 for operating range of ±2g. A silicon-on-glass (SOG) process is adopted to achieve the high aspect-ratio structure, yielding excellent Z-axis sensitivity and resolution as high as 1.434V/g and 49µg/√Hz. The sensitivity and minimum cross-axis sensitivity are 1.442V/g and 0.03% for x-axis and are 1.241V/g and 0.21% for y-axis. This optimized design demonstrates excellent performance satisfying the needs of consumer applications.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"84 1","pages":"297-300"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382175","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical parameters were optimized by theoretical calculation and fine tuned by finite-element-analysis (FEA) and integrated nodal simulation. Three spring-proof mass systems were integrated on a single structure in size of 1.3×1.28mm2 for operating range of ±2g. A silicon-on-glass (SOG) process is adopted to achieve the high aspect-ratio structure, yielding excellent Z-axis sensitivity and resolution as high as 1.434V/g and 49µg/√Hz. The sensitivity and minimum cross-axis sensitivity are 1.442V/g and 0.03% for x-axis and are 1.241V/g and 0.21% for y-axis. This optimized design demonstrates excellent performance satisfying the needs of consumer applications.