High Quality AlGaN/GaN HEMT Homo-epitaxy on 4-inch Homebred GaN Substrate by MOCVD

N. Gao, Y. L. Fang, Z. R. Zhang, J. Y. Yin, B. Wang, J. Li, W. L. Lu, C. L. Niu, H. Chen
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Abstract

High quality AlGaN/GaN HEMT material was grown on the 4-inch GaN substrate by metal-organic chemical vapor deposition (MOCVD). An alternation gas model of ammonia/hydrogen (NH3/H2) mixed gas and H2 gas was employed for the thermal treatment of GaN substrate. Atomic force microscope (AFM) shows straight-step morphology on the surface of the material. The high-resolution X-ray diffractometer (HRXRD) indicates that the full widths at half maximum (FWHM) values of AlGaN/GaN HEMT material for (002) and (102) planes are 48.9 arcsecs and 43.5 arcsecs in the center, respectively. The contactless Hall test results show that the AlGaN/GaN HEMT material has a two dimensional electron gas (2DEG) mobility of 2159 cm2/ V. s and 2DEG density of 8.89 ×1012cm−2, indicating that the homo-epitaxial AlGaN/GaN HEMT material has high quality and good electrical performance.
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利用MOCVD技术在4英寸自制GaN衬底上实现高质量的AlGaN/GaN HEMT同外延
采用金属有机化学气相沉积(MOCVD)技术在4英寸GaN衬底上生长出高质量的AlGaN/GaN HEMT材料。采用氨/氢(NH3/H2)混合气体和H2气体交替气体模型对GaN衬底进行热处理。原子力显微镜(AFM)显示了材料表面的直阶形貌。高分辨率x射线衍射仪(HRXRD)表明,AlGaN/GaN HEMT材料在(002)和(102)平面的半最大全宽(FWHM)值分别为48.9 arcsecs和43.5 arcsecs。无接触霍尔测试结果表明,该材料的二维电子气迁移率为2159 cm2/ V. s,二维电子气密度为8.89 ×1012cm−2,表明该材料具有良好的电学性能和高质量。
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