Breakdown strength affected by the interface roughness at the semiconducting layer in XLPE power cables

T. Okamoto, N. Hozumi, M. Ishida
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引用次数: 10

Abstract

The authors describe the relationship between the breakdown strength and the roughness of the semiconducting interface in model XLPE (cross-linked polyethylene) power cables with insulation of 3.5 mm thickness. Nine kinds of specimen cables were manufactured out of seven kinds of semiconducting layer materials. Six kinds of additives were used to modify the semiconducting materials. The maximum breakdown strength of the specimens was about 1.6 MV/cm (1% Weibull strength) and 1.2 times higher than that of a specimen without additives. The semiconducting interface roughness of less than 1 mu m was quantized by taking transmission electron microscopic photographs of the interface. It was found that the roughness of the outer semiconducting interface is larger than that of the inner ones and has a strong correlation with the breakdown strength.<>
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交联聚乙烯电力电缆半导体层界面粗糙度对击穿强度的影响
描述了绝缘厚度为3.5 mm的XLPE(交联聚乙烯)型电力电缆的击穿强度与半导体界面粗糙度之间的关系。用7种半导体层材料制作了9种样品电缆。采用6种添加剂对半导体材料进行了改性。试样的最大击穿强度约为1.6 MV/cm(1%威布尔强度),是未添加添加剂试样的1.2倍。采用透射电子显微照片对小于1 μ m的半导体界面粗糙度进行量子化。结果表明,半导体界面表面粗糙度大于内部界面粗糙度,且与击穿强度有较强的相关性。
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