Lead the Future : Semiconductor Evolution as Seen by CMP Manufacturers

M. Tsujimura
{"title":"Lead the Future : Semiconductor Evolution as Seen by CMP Manufacturers","authors":"M. Tsujimura","doi":"10.1109/CSTIC49141.2020.9282449","DOIUrl":null,"url":null,"abstract":"The global situation has become increasingly uncertain and it has been a long time since the so-called VUCA era began. The semiconductor market, however, is now booming and semiconductor technology seems to have overcome its stagnation. The market has now entered the so-called Multi-driver era, driven by the IoT, Cloud, AI, Car, and 5G applications, collectively referred to as ICAC5, in addition to the former single set applications, such as PCs and mobile phones. Technologies adapted to the ICAC5 market have also been developed, and device development has been active in three directions: MM (More Moore), MtM (More than Moore), and BC (Beyond CMOS). With the development of semiconductor devices, new technologies are also required for manufacturing equipment such as CMP. Based on the uncertain global outlook, this paper provides an overview of device technology up to 2030 by showing the uniqueness of the semiconductor market, and presents as an example how the CMP process should evolve. Semiconductors are immortal as long as there is human desire. Semiconductors will continue to lead the future of technologies. And semiconductor manufacturing equipment will continue to support the evolution of semiconductor devices.","PeriodicalId":6848,"journal":{"name":"2020 China Semiconductor Technology International Conference (CSTIC)","volume":"52 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC49141.2020.9282449","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The global situation has become increasingly uncertain and it has been a long time since the so-called VUCA era began. The semiconductor market, however, is now booming and semiconductor technology seems to have overcome its stagnation. The market has now entered the so-called Multi-driver era, driven by the IoT, Cloud, AI, Car, and 5G applications, collectively referred to as ICAC5, in addition to the former single set applications, such as PCs and mobile phones. Technologies adapted to the ICAC5 market have also been developed, and device development has been active in three directions: MM (More Moore), MtM (More than Moore), and BC (Beyond CMOS). With the development of semiconductor devices, new technologies are also required for manufacturing equipment such as CMP. Based on the uncertain global outlook, this paper provides an overview of device technology up to 2030 by showing the uniqueness of the semiconductor market, and presents as an example how the CMP process should evolve. Semiconductors are immortal as long as there is human desire. Semiconductors will continue to lead the future of technologies. And semiconductor manufacturing equipment will continue to support the evolution of semiconductor devices.
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引领未来:CMP制造商眼中的半导体演变
全球形势变得越来越不确定,所谓的VUCA时代已经很久没有开始了。但是,半导体市场正在蓬勃发展,半导体技术似乎已经摆脱了停滞状态。目前,市场已经进入所谓的多驱动时代,除了pc、手机等以往的单台应用之外,还有IoT、Cloud、AI、Car、5G等应用,统称为ICAC5。适应ICAC5市场的技术也得到了发展,器件开发在三个方向上非常活跃:MM (More Moore)、MtM (More than Moore)和BC (Beyond CMOS)。随着半导体器件的发展,CMP等制造设备也需要新的技术。基于不确定的全球前景,本文通过展示半导体市场的独特性,概述了到2030年的器件技术,并举例说明了CMP过程应该如何发展。只要人类有欲望,半导体就是不朽的。半导体将继续引领技术的未来。半导体制造设备将继续支持半导体器件的发展。
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