Chemical treatment of CdTe and Cd0.9Zn0.1Te surfaces with iodine-containing solutions

V. G. Ivanitska, Y. I. Nechesnyi, P. Fochuk
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Abstract

The surface quality of semiconductors has a direct impact on the performance of devices made of them. One of the stages in the semiconductor materials technology is chemical treatment of the crystal surface. Etching solutions used for this purpose often contain halogens or compounds based on them. To reduce the dissolution rate of the semiconductor during its etching, a viscous component, such as glycerol, ethylene glycol, etc., is often added to the etching compositions. The paper studied the features of chemical interaction of CdTe and Cd0,96Zn0,04Te, oriented in different crystallographic directions of iodine-containing etchants based system I2 - CH3OH. The influence of ethylene glycol on the results of chemical-dynamic and chemical-mechanical polishing of these semiconductor materials has been clarified. The concentration dependence of the rate of chemical-dynamic and chemical-mechanical polishing of CdTe (111) B, CdTe (110), Cd0,96Zn0,04Te (211) A and Cd0,96Zn0,04Te (110) surfaces was studied. It is shown that the addition of ethylene glycol to solutions of the I2 - methanol system significantly slows down the dissolution rate of both CdTe and Cd0,96Zn0,04Te samples. The addition of only 16 vol.% ethylene glycol into basic solution slows down the interaction more than two times, although a further decrease in the etching rate with increasing ethylene glycol content is not so rapid. Only solutions with an ethylene glycol content not exceeding 40% (chemical-dynamic polishing) and 50% (chemical-mechanical polishing) have polishing properties. The use of solutions with higher ethylene glycol content causes the appearance of a light blue film on their surface, which does not disappear even after careful postoperative treatment. It is shown that the surface roughness of both CdTe and Cd0,96Zn0,04Te after its chemical-mechanical polishing does not exceed 10 nm. This is a characteristic of its high quality and makes it possible to recommend ethylene glycol-modified etchants of the I2 - CH3OH system for chemical-mechanical polishing of the surface of cadmium telluride and solid solutions based on it.
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含碘溶液对CdTe和Cd0.9Zn0.1Te表面的化学处理
半导体的表面质量直接影响到由它们制成的器件的性能。晶体表面的化学处理是半导体材料技术的一个重要环节。用于此目的的蚀刻液通常含有卤素或基于卤素的化合物。为了降低半导体在蚀刻过程中的溶解速率,通常在蚀刻组合物中加入一种粘性组分,如甘油、乙二醇等。本文研究了含碘蚀刻剂I2 - CH3OH体系中CdTe与Cd0,96Zn0,04Te在不同晶体取向下的化学相互作用特征。阐明了乙二醇对这些半导体材料化学动力抛光和化学机械抛光结果的影响。研究了CdTe (111) B、CdTe(110)、Cd0,96Zn0,04Te (211) A和Cd0,96Zn0,04Te(110)表面化学动力学抛光速率和化学机械抛光速率的浓度依赖性。结果表明,在I2 -甲醇体系溶液中加入乙二醇可显著减缓CdTe和Cd0,96Zn0,04Te样品的溶解速度。虽然随着乙二醇含量的增加蚀刻速率的进一步降低不是那么快,但在碱性溶液中加入16%体积%的乙二醇会使相互作用减慢两倍以上。只有乙二醇含量不超过40%(化学动态抛光)和50%(化学机械抛光)的溶液才具有抛光性能。使用乙二醇含量较高的溶液会导致其表面出现浅蓝色薄膜,即使经过仔细的术后处理也不会消失。结果表明,化学机械抛光后的CdTe和Cd0,96Zn0,04Te的表面粗糙度均不超过10 nm。这是其高品质的一个特点,也为推荐I2 - CH3OH体系的乙二醇改性蚀刻剂用于碲化镉及其固溶体表面的化学机械抛光提供了可能。
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