D. Peyrou, P. Pons, H. Granier, D. Leray, A. Ferrand, K. Yacine, M. Saadaoui, A. Nicolas, J. Tao, R. Plana
{"title":"Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations","authors":"D. Peyrou, P. Pons, H. Granier, D. Leray, A. Ferrand, K. Yacine, M. Saadaoui, A. Nicolas, J. Tao, R. Plana","doi":"10.1109/ESIME.2006.1644011","DOIUrl":null,"url":null,"abstract":"This paper presents a study on multiphysics software reliability provided by COMSOL and ANSYS. The goal is to give an overview about the fundamentals of how to set up RF simulations, mechanical contact and residual stress through three examples chosen as the main key points in order to make in the future a highly coupled model of the RF MEMS switches packaging","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":"1 1","pages":"1-8"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1644011","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This paper presents a study on multiphysics software reliability provided by COMSOL and ANSYS. The goal is to give an overview about the fundamentals of how to set up RF simulations, mechanical contact and residual stress through three examples chosen as the main key points in order to make in the future a highly coupled model of the RF MEMS switches packaging
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