SEU Sensitivity of a 14-nm SOI FinFET eDRAM Cell under Heavy-ion Irradiation

K. Aditya, Rohit Saini, Manoj Kumar, Ramendra Singh, A. Dixit
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Abstract

In this paper, we have evaluated the single event upset (SEU) sensitivity of an embedded-DRAM (eDRAM) in presence of heavy-ion irradiation using 3-D TCAD simulations. The eDRAM with an access time of $\sim 1$ ns is simulated using a calibrated 10.2 fF deep trench (DT) capacitor appended to a 14nm SOI-FinFET using mixed mode TCAD simulations. We have evaluated the impact of direction and position of the incident heavy-ion with linear energy transfer (LET) of 10 MeV-cm2/mg on the calibrated 14nm SOI-FinFET. The worst-case direction and position of heavy-ion are then used for evaluation of the SEU performance of eDRAM under heavy-ion irradiation. Our analysis is the first of its kind in analyzing the effect of heavy-ion irradiation on SEU sensitivity of eDRAM. We report that the critical LET for SEU to occur in the eDRAM is 500 MeV-cm2/mg which is 5 times better than the critical LET reported for SRAMs.
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重离子辐照下14nm SOI FinFET eDRAM电池的SEU灵敏度
在本文中,我们利用三维TCAD模拟评估了重离子辐照下嵌入式dram (eDRAM)的单事件扰动(SEU)灵敏度。使用附加在14nm SOI-FinFET上的校准10.2 fF深沟槽(DT)电容器,使用混合模式TCAD模拟了访问时间为$ $ sim 1$ ns的eDRAM。我们评估了10 MeV-cm2/mg线性能量转移(LET)的重离子入射方向和位置对校准的14nm SOI-FinFET的影响。然后利用重离子的最差方向和位置来评价eDRAM在重离子辐照下的SEU性能。我们的分析是首次分析重离子辐照对eDRAM的SEU敏感性的影响。我们报告说,eDRAM中SEU发生的临界LET为500 MeV-cm2/mg,比sram报告的临界LET好5倍。
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