A high performance double gate dopingless metal oxide semiconductor field effect transistor

S. Loan, F. Bashir, M. Rafat, A. Alamoud, S. A. Abbasi
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引用次数: 6

Abstract

In this work, we propose a new structure of a double gate dopingless metal oxide semiconductor field effect transistor (MOSFET). The proposed device does not employ the conventional ways of ion implantation or diffusion to realize source and drain regions. However, it uses metals of different workfunctions to induce n+ source and drain regions in undoped silicon; a charge plasma concept. A 2D numerical simulation study has shown that a significant improvement in various performance parameters has been achieved in the proposed device. It is observed that the subthreshold slope (S) and cutoff frequency (fT)has significantly improved in the proposed device in comparison to a conventional doped MOSFET. Further, the leakage current was significantly decreased in the proposed device. Furthermore, since the proposed device does not employ ion implantation or diffusion to realize source and drain regions, therefore, it is free from random doping fluctuations (RDF) and doping control issues, and most importantly, it can be processed at low temperature.
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一种高性能双栅无掺杂金属氧化物半导体场效应晶体管
本文提出了一种双栅无掺杂金属氧化物半导体场效应晶体管(MOSFET)的新结构。该装置不采用传统的离子注入或扩散方式来实现源区和漏区。然而,它使用不同功函数的金属在未掺杂的硅中诱导n+源区和漏区;电荷等离子体的概念。一项二维数值模拟研究表明,所提出的装置在各种性能参数方面都取得了显着改善。观察到,与传统的掺杂MOSFET相比,该器件的亚阈值斜率(S)和截止频率(fT)显著提高。此外,在所提出的器件中,泄漏电流显着降低。此外,由于该器件不采用离子注入或扩散来实现源极和漏极,因此,它不存在随机掺杂波动(RDF)和掺杂控制问题,最重要的是,它可以在低温下加工。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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