{"title":"Session 20 overview: Flash-memory solutions: Memory subcommittee","authors":"Ki-Tae Park, Yan Li, Leland Chang","doi":"10.1109/ISSCC.2018.8310320","DOIUrl":null,"url":null,"abstract":"Continued proliferation of semiconductors for a smarter society drives the evolution of flash memory technologies towards higher density, lower power consumption, and lower cost. This year, a new generation of 3D NAND Flash memory with up to 96-stacked word-line layers is introduced. For the first time, a memory with over 1Tb density is demonstrated using a 4b/cell 3D NAND technology. An ultra-low latency flash controller with a new high-speed 3D NAND is proposed in order to fill a large performance gap between DRAM and Flash memories.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"55 1","pages":"334-335"},"PeriodicalIF":0.0000,"publicationDate":"2018-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2018.8310320","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Continued proliferation of semiconductors for a smarter society drives the evolution of flash memory technologies towards higher density, lower power consumption, and lower cost. This year, a new generation of 3D NAND Flash memory with up to 96-stacked word-line layers is introduced. For the first time, a memory with over 1Tb density is demonstrated using a 4b/cell 3D NAND technology. An ultra-low latency flash controller with a new high-speed 3D NAND is proposed in order to fill a large performance gap between DRAM and Flash memories.
智能社会对半导体的持续发展推动了闪存技术向更高密度、更低功耗和更低成本的方向发展。今年,推出了新一代3D NAND闪存,最多可堆叠96层字行层。首次使用4b/cell 3D NAND技术展示了超过1Tb密度的存储器。为了填补DRAM和闪存之间的巨大性能差距,提出了一种具有新型高速3D NAND的超低延迟闪存控制器。