Pub Date : 2023-02-19DOI: 10.1109/isscc42615.2023.10067454
P. Wambacq
{"title":"Foreword: Building on 70 Years of Innovation in Solid-State Circuit Design","authors":"P. Wambacq","doi":"10.1109/isscc42615.2023.10067454","DOIUrl":"https://doi.org/10.1109/isscc42615.2023.10067454","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"24 1","pages":"5"},"PeriodicalIF":0.0,"publicationDate":"2023-02-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73476310","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-01-01DOI: 10.1109/ISSCC42614.2022.9731743
Li Xu, Maya Lassiter, Xiao Wu, Yejoong Kim, Jungho Lee, M. Yasuda, Masaru Kawaminami, Marc Z. Miskin, D. Blaauw, D. Sylvester
{"title":"A 210×340×50µm Integrated CMOS System f0r Micro-Robots with Energy Harvesting, Sensing, Processing, Communication and Actuation","authors":"Li Xu, Maya Lassiter, Xiao Wu, Yejoong Kim, Jungho Lee, M. Yasuda, Masaru Kawaminami, Marc Z. Miskin, D. Blaauw, D. Sylvester","doi":"10.1109/ISSCC42614.2022.9731743","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731743","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"9 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90406090","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-01-01DOI: 10.1109/ISSCC42614.2022.9731643
A. Geus
{"title":"Catalyzing the Impossible: Silicon, Software, and Smarts for the SysMoore Era","authors":"A. Geus","doi":"10.1109/ISSCC42614.2022.9731643","DOIUrl":"https://doi.org/10.1109/ISSCC42614.2022.9731643","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"86 1","pages":"10-16"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79387231","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-02-13DOI: 10.1109/ISSCC42613.2021.9365814
Sukhwan Lim, L. Benini, V. Sze
{"title":"Session 9 Overview: ML Processors From Cloud to Edge Machine Learning Subcommittee","authors":"Sukhwan Lim, L. Benini, V. Sze","doi":"10.1109/ISSCC42613.2021.9365814","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365814","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"1 1","pages":"142-143"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86839396","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-02-13DOI: 10.1109/ISSCC42613.2021.9366020
Kenneth C. Smith, L. Fujino
W. David Pricer passed away April 15, 2020 (age 84) at his home in Charlotte, Vermont. Dave held BS and MS degrees in Electrical Engineering from Massachusetts Institute of Technology, and an AB degree in Physics from Middlebury College, all in 1959!
W. David Pricer于2020年4月15日在佛蒙特州夏洛特的家中去世，享年84岁。Dave于1959年获得麻省理工学院电气工程学士和硕士学位，以及米德尔伯里学院物理学学士学位!
{"title":"Remembrances of Dave Pricer","authors":"Kenneth C. Smith, L. Fujino","doi":"10.1109/ISSCC42613.2021.9366020","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9366020","url":null,"abstract":"W. David Pricer passed away April 15, 2020 (age 84) at his home in Charlotte, Vermont. Dave held BS and MS degrees in Electrical Engineering from Massachusetts Institute of Technology, and an AB degree in Physics from Middlebury College, all in 1959!","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"32 1","pages":"5"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89021821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-02-13DOI: 10.1109/ISSCC42613.2021.9365824
Negar Reiskarimian, Z. Deniz, U. Guler, Kathy Wilcox, Alice Wang, Jane Gu, Yaoyao Jia, Alicia Klinefelter, Rikky Muller, F. Sheikh, Yildiz Sinangil, T. Stetzler, V. Sze, R. Yazicigil, Deeksha Lal, D. El-Damak
{"title":"SE4: ICs in PandemICs","authors":"Negar Reiskarimian, Z. Deniz, U. Guler, Kathy Wilcox, Alice Wang, Jane Gu, Yaoyao Jia, Alicia Klinefelter, Rikky Muller, F. Sheikh, Yildiz Sinangil, T. Stetzler, V. Sze, R. Yazicigil, Deeksha Lal, D. El-Damak","doi":"10.1109/ISSCC42613.2021.9365824","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365824","url":null,"abstract":"","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"20 1","pages":"543-545"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88642989","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-02-13DOI: 10.1109/ISSCC42613.2021.9366043
Kevin Zhang, M. Ikeda
The Plenary Session will begin with welcome remarks, and an introduction from the Conference Chair, Jan van der Spiegel. Then, Eugenio Cantatore, the Technical Program Chair, will provide an overview of ISSCC 2019. Next, the Plenary Session will feature four keynote speakers, who are renowned leaders in their respective fields. In line with the Conference theme, “Envisioning the Future”, they will overview important innovation trends that are predicted to have a strong impact on the further development of Integrated circuits and systems: Artificial Intelligence (AI) and Machine Learning (ML), integration of photonics and electronics, and 5G. An Awards Ceremony that recognizes major technical and professional accomplishments, presented by the IEEE, Solid-State-Circuits Society (SSCS), and ISSCC, will take place following the second plenary talk. plenaries as local learning and brain-mimicking functions) are addressed. The next two plenary talks focus on the future of communication technologies: The integration of photonic functions in photonic chips, and the creation of new systems that put together integrated electronics and photonics is one of the most compelling emerging technologies today. Meint Smit, Professor of Photonic Integration at the Eindhoven University of Technology, provides an overview of the state-of-the-art in InP- and Si-based photonics, reviewing similarities and differences, and discussing in detail membrane-based InP photonic technologies supporting efficient integration with electronics. is human-human inflection is and key the disruptive architectures and technology innovations of plenary personal of the motivating be the two horses driving the carriage called AI, thus opening up new requirements for the next generation deep learning SoCs. The application market for Photonic Integrated Circuits (PICs) is rapidly growing. Photonic Integration is the dominant technology in high bandwidth communications and is set to become dominant in many fields of photonics, just like microelectronics in the field of electronics. Photonic integrated circuits offer compelling performance advances in terms of precision, bandwidth and energy efficiency. To enable uptake in new sectors, the availability of highly standardized (generic) photonic integration platform technologies is of key importance as this separates design from technology, reducing barriers for new entrants. The major platform technologies today are InP-based monolithic integration and Silicon Photonics. In this perspective paper we will describe the current status and future developments of InP-based generic integration platforms. The 5G era is upon us, ushering in new opportunities for technology innovation across the computing and connectivity landscape. 5G presents an inflection point where wireless communication technology is driven by application and expected use cases, and where the network will set the stage for data-rich services and sophisticated cloud apps, delivered fa
{"title":"Session 1 Overview Plenary Session - Invited Papers","authors":"Kevin Zhang, M. Ikeda","doi":"10.1109/ISSCC42613.2021.9366043","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9366043","url":null,"abstract":"The Plenary Session will begin with welcome remarks, and an introduction from the Conference Chair, Jan van der Spiegel. Then, Eugenio Cantatore, the Technical Program Chair, will provide an overview of ISSCC 2019. Next, the Plenary Session will feature four keynote speakers, who are renowned leaders in their respective fields. In line with the Conference theme, “Envisioning the Future”, they will overview important innovation trends that are predicted to have a strong impact on the further development of Integrated circuits and systems: Artificial Intelligence (AI) and Machine Learning (ML), integration of photonics and electronics, and 5G. An Awards Ceremony that recognizes major technical and professional accomplishments, presented by the IEEE, Solid-State-Circuits Society (SSCS), and ISSCC, will take place following the second plenary talk. plenaries as local learning and brain-mimicking functions) are addressed. The next two plenary talks focus on the future of communication technologies: The integration of photonic functions in photonic chips, and the creation of new systems that put together integrated electronics and photonics is one of the most compelling emerging technologies today. Meint Smit, Professor of Photonic Integration at the Eindhoven University of Technology, provides an overview of the state-of-the-art in InP- and Si-based photonics, reviewing similarities and differences, and discussing in detail membrane-based InP photonic technologies supporting efficient integration with electronics. is human-human inflection is and key the disruptive architectures and technology innovations of plenary personal of the motivating be the two horses driving the carriage called AI, thus opening up new requirements for the next generation deep learning SoCs. The application market for Photonic Integrated Circuits (PICs) is rapidly growing. Photonic Integration is the dominant technology in high bandwidth communications and is set to become dominant in many fields of photonics, just like microelectronics in the field of electronics. Photonic integrated circuits offer compelling performance advances in terms of precision, bandwidth and energy efficiency. To enable uptake in new sectors, the availability of highly standardized (generic) photonic integration platform technologies is of key importance as this separates design from technology, reducing barriers for new entrants. The major platform technologies today are InP-based monolithic integration and Silicon Photonics. In this perspective paper we will describe the current status and future developments of InP-based generic integration platforms. The 5G era is upon us, ushering in new opportunities for technology innovation across the computing and connectivity landscape. 5G presents an inflection point where wireless communication technology is driven by application and expected use cases, and where the network will set the stage for data-rich services and sophisticated cloud apps, delivered fa","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"24 1","pages":"7-8"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87463798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-02-13DOI: 10.1109/ISSCC42613.2021.9365836
S. Sankaran, P. Reynaert, S. Amakawa
The THz frontier continues to be pushed by mainstream-CMOS circuits with excellent performance. The papers present diverse circuits and front-ends extending state of the art on linearity, signal generation/steering, and detection sensitivity. The first paper presents a THz upconverter leveraging the benefit of parametric gain using optimally biased varactors for enhanced even-order harmonic generation. A THz 2D beamsteering pixel-array source with the capability to spatially and electronically steer is presented in the second paper. The session continues with an ultra-low power and area THz detector with leading-edge noise performance and concludes with a W-band PLL demonstrating best-in-class jitter and FoM.
{"title":"Session 23 Overview: THz Circuits and Front-Ends Rf Subcommittee","authors":"S. Sankaran, P. Reynaert, S. Amakawa","doi":"10.1109/ISSCC42613.2021.9365836","DOIUrl":"https://doi.org/10.1109/ISSCC42613.2021.9365836","url":null,"abstract":"The THz frontier continues to be pushed by mainstream-CMOS circuits with excellent performance. The papers present diverse circuits and front-ends extending state of the art on linearity, signal generation/steering, and detection sensitivity. The first paper presents a THz upconverter leveraging the benefit of parametric gain using optimally biased varactors for enhanced even-order harmonic generation. A THz 2D beamsteering pixel-array source with the capability to spatially and electronically steer is presented in the second paper. The session continues with an ultra-low power and area THz detector with leading-edge noise performance and concludes with a W-band PLL demonstrating best-in-class jitter and FoM.","PeriodicalId":6511,"journal":{"name":"2016 IEEE International Solid-State Circuits Conference (ISSCC)","volume":"92 1","pages":"322-323"},"PeriodicalIF":0.0,"publicationDate":"2021-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91111525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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