Aftershock effects on the reliability of electronic components under shock test

Y.S. Chen, Yu-chun Huang
{"title":"Aftershock effects on the reliability of electronic components under shock test","authors":"Y.S. Chen, Yu-chun Huang","doi":"10.1109/IMPACT.2009.5382198","DOIUrl":null,"url":null,"abstract":"Shock test is one of the significant reliability tests for electronics products. JEDEC test standards regulate only the first controlled-pulse by defining a variety of conditions such as the pulse peak acceleration, pulse duration and velocity change during the drop impact processes. In reality, a practical test showed that not only was one pulse produced, but also a series of two or more aftershocks are encountered. Hence, it is doubtful on whether and how the aftershocks influence results of components' reliability. The purpose of this study is to investigate the aftershocks' effect on the test products and to predict the time interval of its occurrence as well as the relating acceleration responses. The investigations include experimental, theoretical and finite element analysis methods. The severity of aftershock and the time instant it happens were first tested and modeled precisely. This model was then used as input both for theoretical and numerical calculations to solve system's response. Good consistencies among results of all three methods are observed, it is then possible to use the theoretical and FEA methods for the shock design of electronic systems prior to the manufacturing of the prototypes. Most importantly, the corresponding outcomes have taken the aftershock into consideration instead of only the primary pulse. It is believed to be more accurate in the reliability analysis of electronic products.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"142 1","pages":"385-388"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382198","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Shock test is one of the significant reliability tests for electronics products. JEDEC test standards regulate only the first controlled-pulse by defining a variety of conditions such as the pulse peak acceleration, pulse duration and velocity change during the drop impact processes. In reality, a practical test showed that not only was one pulse produced, but also a series of two or more aftershocks are encountered. Hence, it is doubtful on whether and how the aftershocks influence results of components' reliability. The purpose of this study is to investigate the aftershocks' effect on the test products and to predict the time interval of its occurrence as well as the relating acceleration responses. The investigations include experimental, theoretical and finite element analysis methods. The severity of aftershock and the time instant it happens were first tested and modeled precisely. This model was then used as input both for theoretical and numerical calculations to solve system's response. Good consistencies among results of all three methods are observed, it is then possible to use the theoretical and FEA methods for the shock design of electronic systems prior to the manufacturing of the prototypes. Most importantly, the corresponding outcomes have taken the aftershock into consideration instead of only the primary pulse. It is believed to be more accurate in the reliability analysis of electronic products.
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余震对冲击试验中电子元件可靠性的影响
冲击试验是电子产品可靠性试验的重要内容之一。JEDEC测试标准通过定义各种条件,如脉冲峰值加速度、脉冲持续时间和跌落冲击过程中的速度变化,仅调节第一个受控脉冲。在现实中,实际测试表明,不仅产生了一个脉冲,而且还遇到了一系列两次或更多的余震。因此,余震是否以及如何影响构件可靠性的结果值得怀疑。本研究的目的是探讨余震对试验产品的影响,并预测其发生的时间间隔以及相关的加速度响应。研究包括实验、理论和有限元分析方法。首先对余震的严重程度和发生时间进行了精确的测试和模拟。然后将该模型作为理论和数值计算的输入,求解系统的响应。观察到所有三种方法的结果之间具有良好的一致性,因此可以在原型制造之前使用理论和有限元方法进行电子系统的冲击设计。最重要的是,相应的结果考虑了余震,而不仅仅是主脉冲。它被认为在电子产品的可靠性分析中更为准确。
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