The prospects and challenges in junction process technology for advanced semiconductor devices

K. Suguro
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引用次数: 2

Abstract

Historical background of ion implantation technology in semiconductor devices is reviewed in conjunction with electrical activation of impurity atoms, annealing of primary defects introduced during ion implantation as well as the diffusion of impurity atoms. Next the prospects and challenges in junction process technology for advanced semiconductor devices are discussed.
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先进半导体器件结制程技术的前景与挑战
综述了半导体器件中离子注入技术的历史背景,包括杂质原子的电活化、离子注入过程中引入的初级缺陷的退火以及杂质原子的扩散。展望了先进半导体器件结制工艺的发展前景和面临的挑战。
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