Wide frequency band scalable modeling of 3D embedded decoupling capacitors

Abstract

This paper presents an extended wide-band physical scalable model developed at LETI for 3D high density trench decoupling capacitors manufactured by IPDIA. The capacitors provide a density of 80 nF/mm2 and are embedded in a high resistivity silicon substrate. Use of such capacitors for mixed circuits decoupling and filtering applications requires wide-band SPICE models. Therefore, a focus is done on improving the model frequency validity range in the low and high frequency bands. This paper proposes a new 3D trench decoupling capacitor R, L, C circuit topology including interconnects with a frequency range from 10 kHz up to 10 GHz.