Pingjuan Niu, Hao Sun, Liu Zhaofeng, Liu Qiang, Cao Shinan, Tian Haitao
{"title":"Design And Force Analysis of The Chip Transfer Platform for Mass Transfer","authors":"Pingjuan Niu, Hao Sun, Liu Zhaofeng, Liu Qiang, Cao Shinan, Tian Haitao","doi":"10.1109/SSLChinaIFWS54608.2021.9675200","DOIUrl":null,"url":null,"abstract":"Micro LED is a new generation displays with the fast response, low power consumption, high reliability and long life. The main process for the manufacture of the Micro LED is the transfer the Micro LED chips to the circuit boards. To improve the speed of the mass transfer, a Micro LED chips transfer platform was designed and the detailed description of the platforms work is presented. A 3D view of the platform is created, Than a analysis of the deformation of the chip carrier board during platform operation was been carried out. The result shows that the new platform can guarantee the deformation of the chips and the mass transfer speed can be improved as no need of the swing arm.","PeriodicalId":6816,"journal":{"name":"2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS)","volume":"18 1","pages":"143-145"},"PeriodicalIF":0.0000,"publicationDate":"2021-12-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 18th China International Forum on Solid State Lighting & 2021 7th International Forum on Wide Bandgap Semiconductors (SSLChina: IFWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SSLChinaIFWS54608.2021.9675200","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
Micro LED is a new generation displays with the fast response, low power consumption, high reliability and long life. The main process for the manufacture of the Micro LED is the transfer the Micro LED chips to the circuit boards. To improve the speed of the mass transfer, a Micro LED chips transfer platform was designed and the detailed description of the platforms work is presented. A 3D view of the platform is created, Than a analysis of the deformation of the chip carrier board during platform operation was been carried out. The result shows that the new platform can guarantee the deformation of the chips and the mass transfer speed can be improved as no need of the swing arm.
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