Recent Advances in Underfill Materials

O. Suzuki
{"title":"Recent Advances in Underfill Materials","authors":"O. Suzuki","doi":"10.4071/2380-4505-2019.1.invitedaihardware000014","DOIUrl":null,"url":null,"abstract":"\n Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"6 2 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/2380-4505-2019.1.invitedaihardware000014","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Invited Session on FUTURE SEMICONDUCTOR PACKAGES FOR AI HARDWARE. Outline: Applications for Advanced Packaging; Global AI Computing Hardware Total Available Market (TAM); Die partitions; Defect Density; FC-BGA Families Trends; Technical Challenges of CUF; Underfills for Advanced Packaging; Severe KOZ on MCM; Bleed Out; Formulation Technique; Concerns during penetration; Chip package interaction (CPI) Challenges; and summary.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
下填材料的最新进展
邀请讨论AI硬件的未来半导体封装。概述:先进包装的应用;全球人工智能计算硬件总可用市场(TAM)死分区;缺陷密度;FC-BGA家族趋势;CUF的技术挑战;先进包装的下填料;MCM重度KOZ;流血;配方技术;渗透过程中的关注点;芯片封装交互(CPI)挑战;和总结。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturing Lithography Solutions for Submicron Panel-Level Packaging
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1