International Symposium on Microelectronics

683

微信好友朋友圈 QQ好友复制链接

查看最新文献

发文信息

International Symposium on Microelectronics - 最新文献

查看全部

Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturing

Pub Date : 2021-10-01 DOI: 10.4071/1085-8024-2021.1.000026 Stephen M. Rothrock

Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-Layer

Pub Date : 2021-10-01 DOI: 10.4071/1085-8024-2021.1.000217 C. Peng, J. Lau, C. Ko, Paul Lee, E. Lin, Kai-Ming Yang, P. Lin, Tim Xia, Leo Chang, N. Liu, Curry Lin, T. Lee, Jason Wang, M. Ma, T. Tseng

Thermal and Reliability Performance Comparison of DBC-Based and Organic-Based Double-Sided Cooled Power Modules

Pub Date : 2021-10-01 DOI: 10.4071/1085-8024-2021.1.000382 Tzu-Hsuan Cheng, Kenji Nishiguchi, Y. Fukawa, D. Hopkins

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。

Book学术文献互助群
群号：481959085

文献互助智能选刊最新文献互助须知联系我们：info@booksci.cn