Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs

Kazue Hirano, Masaya Toba, Masaki Yamaguchi
{"title":"Low Transmission Loss Cu Wirings with Smooth Seed Layer and High Adhesion against Prepregs","authors":"Kazue Hirano, Masaya Toba, Masaki Yamaguchi","doi":"10.4071/1085-8024-2021.1.000308","DOIUrl":null,"url":null,"abstract":"\n Semiconductor packages for high performance devices with printed circuit boards having multi wiring layers such as FC-BGA have been attracting the attention in order to realize ultra-reliable and low latency communications in 5G networking. Cu wirings for the package are usually fabricated by semi-additive process (SAP) with desmear process and/or modified semi-additive process (MSAP) by using Cu foil with large surface roughness. Though a desmear process and Cu foil can obtain enough adhesion between dielectric and Cu seed layer by anchoring effect to secure reliabilities, the interface between dielectric and Cu seed layer should be smooth to achieve low attenuation of electric signals at high frequencies. Here, instead of that processes, we applied an UV modification for the surface of our developed prepreg in order to realize a smooth and high adhesive seed layer against the dielectric. We also conducted chemical modification for the surface of Cu foil to achieve low attenuation of transmission loss and high adhesion against prepreg. We successfully assembled Cu wirings with L/S = 6/6 μm on prepregs by SAP. High peel strength between Cu foil and prepreg was obtained due to chemical modification for the surface of Cu foil. The normalized transmission loss of Cu wiring assembled through MSAP was improved as compared to Cu foil with rough surface.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"17 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000308","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Semiconductor packages for high performance devices with printed circuit boards having multi wiring layers such as FC-BGA have been attracting the attention in order to realize ultra-reliable and low latency communications in 5G networking. Cu wirings for the package are usually fabricated by semi-additive process (SAP) with desmear process and/or modified semi-additive process (MSAP) by using Cu foil with large surface roughness. Though a desmear process and Cu foil can obtain enough adhesion between dielectric and Cu seed layer by anchoring effect to secure reliabilities, the interface between dielectric and Cu seed layer should be smooth to achieve low attenuation of electric signals at high frequencies. Here, instead of that processes, we applied an UV modification for the surface of our developed prepreg in order to realize a smooth and high adhesive seed layer against the dielectric. We also conducted chemical modification for the surface of Cu foil to achieve low attenuation of transmission loss and high adhesion against prepreg. We successfully assembled Cu wirings with L/S = 6/6 μm on prepregs by SAP. High peel strength between Cu foil and prepreg was obtained due to chemical modification for the surface of Cu foil. The normalized transmission loss of Cu wiring assembled through MSAP was improved as compared to Cu foil with rough surface.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
具有光滑种子层和对预浸料高附着力的低传输损耗铜线
为了在5G网络中实现超可靠、低延迟通信,FC-BGA等多层印刷电路板的高性能器件半导体封装备受关注。封装用铜布线通常采用带涂膜的半添加工艺(SAP)和/或使用表面粗糙度较大的铜箔的改进半添加工艺(MSAP)制造。虽然涂膜工艺和铜箔可以通过锚定效应在介电介质和铜籽层之间获得足够的附着力以保证可靠性,但介电介质和铜籽层之间的界面必须平滑,以实现高频电信号的低衰减。在这里,我们对我们开发的预浸料的表面进行了紫外线改性,以实现对电介质的光滑和高粘性种子层。我们还对铜箔表面进行了化学改性,以达到低传输损耗衰减和对预浸料的高附着力。利用SAP成功组装了L/S = 6/6 μm预浸料的铜线,并对预浸料表面进行了化学改性,获得了较高的剥离强度。与表面粗糙的铜箔相比,通过MSAP组装的铜导线的归一化传输损耗有所改善。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturing Lithography Solutions for Submicron Panel-Level Packaging
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1