Ultra wide-band, low Loss RF substrate with high-density DC routing supporting 5G/6G flip-chip RFICs

T. Smith, Bill Rhyne, Christopher Hatfield
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Abstract

This paper presents the development of a substrate/interposer technology that is capable of supporting DC signal line routing down to <1mil trace and space densities, but also supports wideband, high-frequency and industry leading low loss RF routing from to beyond 175GHz. Building off of the proven performance and reliability of the PolyStrata® technology enabled air-coax routing, this paper discusses the development and addition of a redistribution technology that enables multilayer, high density DC signal routing at any point during the PolyStrata® process. This enhances the Polystrata® offering to a truly integrated substrate manufacturing process supporting high density interconnect requirement of flip-chip RF ICs as well as low loss high performance RF routing. The paper describes the design and fabrication of a demonstration part designed to accept a D-Band Flip-Chip RFIC. The chip side interconnects are 50um diameter copper pillar with solder cap, at 100um pitch with over 200 interconnects on a die. Multiple connections were required from 10Ghz to 175GHz as well has 30+ DC signal lines. The design can support this level of interconnect density and act as an interposer for next level interconnect to a printed circuit board. DC lines were routed out to a 400um pitch while RF interconnects can support transitions to micro-strip or strip-line PCB routing technology or waveguide, for easy and low loss interconnect to the next level system. An added benefit of being integrated into the PolyStrata® process is that high-performance passive components can be monolithically integrated into the interposer, and the demonstration vehicle implements a mmWave pass-band filter as well.
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超宽带、低损耗射频衬底,高密度直流路由,支持5G/6G倒装rfic
本文介绍了衬底/中间层技术的发展,该技术能够支持直流信号线路由到<1mil的走线和空间密度,但也支持宽带,高频和行业领先的低损耗射频路由从175GHz以上。基于PolyStrata®技术支持空气同轴布线的成熟性能和可靠性,本文讨论了一种重新分配技术的开发和添加,该技术可以在PolyStrata®过程中的任何点实现多层高密度直流信号路由。这增强了Polystrata®提供的真正集成基板制造工艺,支持倒装射频ic的高密度互连要求以及低损耗高性能射频路由。本文介绍了一个d波段倒装射频电路的演示部分的设计和制作。芯片侧互连是直径50um的铜柱,带焊帽,间距100um,在一个芯片上有200多个互连。从10Ghz到175GHz需要多个连接,并且有30多个直流信号线。该设计可以支持这种级别的互连密度,并作为下一级互连到印刷电路板的中间层。直流线路布线到400um间距,而RF互连可以支持过渡到微带或带线PCB布线技术或波导,从而轻松低损耗地连接到下一级系统。集成到PolyStrata®工艺的另一个好处是,高性能无源元件可以单片集成到中间器中,并且演示车辆也实现了毫米波通带滤波器。
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