FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLY

R. Mao, Fen Chen, N. Lee
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引用次数: 2

Abstract

A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the component placement and reflow stage, but ends up with a low viscosity flux residue after reflow, thus facilitating the flux residue to be cleaned. A technique for forming such special fluxes is to establish a temporary association force within the materials themselves, such as an acid-base association. This kind of association force can increase the apparent molecular weight and cause material viscosity to increase. After a heating process, one of the critical ingredients was evaporated, thus eliminating the association force, causing a decrease in the apparent molecular weight, and consequently a decrease in viscosity or an increase in mobility. The evaporation of one ingredient can be the result of one ingredient having a lower boiling point, or the decomposition of one ingredient during heating. A strong association force is desired to allow this acid-base combination approach to work. In this work, the volatile ingredient approach was less effective than a decomposable ingredient approach, presumably due to the formation of a bigger association cluster from the decomposable ingredient. Accordingly, the decomposable ingredient was the best approach to lower flux viscosity after reflow.
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倒装芯片和sip组件回流后粘度降低的助熔剂
开发了一系列的助熔剂系统,可以降低回流后的粘度。这使得在组件放置和回流阶段使用高粘度,高粘性的助焊剂来固定组件,但回流后的助焊剂残留物粘度较低,从而便于清洗助焊剂残留物。形成这种特殊助焊剂的一种技术是在材料本身内部建立一种临时的结合力,例如酸碱结合力。这种结合力使表观分子量增大,使物料粘度增大。经过加热过程后,其中一种关键成分被蒸发,从而消除了结合力,导致表观分子量降低,从而降低了粘度或增加了流动性。一种成分的蒸发可能是一种成分沸点较低的结果,或者是一种成分在加热过程中分解的结果。要使这种酸碱结合方法起作用,需要有很强的结合力。在这项工作中,挥发性成分方法不如可分解成分方法有效,可能是由于可分解成分形成了更大的关联簇。因此,可分解组分是降低回流后熔剂粘度的最佳途径。
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