Cross-correlation of specification and RTL for soft IP analysis

B. Singh, Arunprasath Shankar, F. Wolff, C. Papachristou, D. Weyer, Steve Clay
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引用次数: 9

Abstract

Semiconductor companies often use 3rd party IPs in order to improve their design productivity. In practice, there are risks involved in using a 3rd party IP as bugs may creep in due to versioning issues, poor documentation, and mismatches between specification and RTL. As a result of this, 3rd party IP specification and RTL must be carefully evaluated. Our methodology addresses this issue, which cross-correlates specification and RTL to discover these discrepancies. The key innovative ideas in our approach are to use prior and trusted experience about designs, which include their specs and RTL code. Also, we have captured this trusted experience into two knowledge bases (KB), Spec-KB and RTL-KB. Finally, knowledge base rules are used to cross-correlate the RTL blocks to the specs. We have tested our approach by analyzing several 3rd party IPs. We have defined metrics for specification coverage and RTL identification coverage to quantify our results.
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软IP分析中规格与RTL的相互关系
为了提高设计效率,半导体公司经常使用第三方ip。在实践中,使用第三方IP存在风险,因为版本问题、糟糕的文档以及规范与RTL之间的不匹配可能会导致bug的出现。因此,必须仔细评估第三方IP规范和RTL。我们的方法解决了这个问题,交叉关联规范和RTL来发现这些差异。我们方法中的关键创新思想是使用有关设计的先前和可信赖的经验,包括其规格和RTL代码。此外,我们还将这种可信赖的经验捕获到两个知识库(知识库)中,Spec-KB和RTL-KB。最后,使用知识库规则将RTL块与规范交叉关联。我们通过分析几个第三方ip来测试我们的方法。我们已经定义了规范覆盖和RTL识别覆盖的度量来量化我们的结果。
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