Damage Accumulation in Printed Interconnects on Flex Under Combinations of Bending and Tension with Different Amplitudes

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Pub Date : 2020-06-01 DOI:10.1109/ectc32862.2020.00196

R. Sivasubramony, M. Alhendi, M. Kokash, M. Yadav, A. Raj, S. Thekkut, E. Enakerakpo, N. Adams, P. Borgesen, M. Poliks

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引用次数: 2

Abstract

The life of a flexible hybrid electronics (FHE) product under realistic use conditions may often be limited by fatigue of the interconnects between components. This is especially true for printed traces on flex. Even if the product is only intended for use for a short time, so that accelerated testing is not required, common test protocols tend to miss critical interactions between sequential strain amplitudes, strain rates and dwells, and/or between different loading modes. Indications are that this may lead the ‘worst-case’ life to be less than anticipated by an order of magnitude or more.A comprehensive ongoing study is characterizing the behavior of different screen printed inks on TPU, PET and Kapton with and without encapsulants, as well as laser and thermally sintered aerosol jet printed nano-Ag and nano-Cu traces on Upilex and Kapton. While many details are unique to a particular combination of trace and substrate a generic picture is emerging.

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不同幅度弯曲和拉伸组合作用下挠性印刷互连的损伤累积

柔性混合电子(FHE)产品在实际使用条件下的寿命通常会受到组件之间互连疲劳的限制。对于挠性上的印刷痕迹尤其如此。即使产品仅用于短时间使用，因此不需要加速测试，常见的测试方案往往会错过顺序应变幅度，应变速率和驻留之间的关键相互作用，和/或不同加载模式之间的相互作用。有迹象表明，这可能会导致“最坏情况”的寿命比预期的少一个数量级或更多。一项正在进行的综合研究正在表征不同丝网印刷油墨在TPU, PET和Kapton上的行为，以及激光和热烧结气溶胶射流在Upilex和Kapton上印刷纳米银和纳米铜痕迹。虽然许多细节是独特的特定组合的痕迹和基板，一个通用的图片正在出现。

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2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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