{"title":"Back-Side Residue Analyses and Reduction in FinFET Middle of Line Wafers","authors":"R. Mitra, A. Konuk","doi":"10.1109/ASMC49169.2020.9185280","DOIUrl":null,"url":null,"abstract":"This paper reports the analytical methods used to detect the composition of residue on back-side of wafer. Further it discusses impact of this back-side residue on front-side of wafer flatness and how this residue was reduced by a new developed clean.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"10 4 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185280","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper reports the analytical methods used to detect the composition of residue on back-side of wafer. Further it discusses impact of this back-side residue on front-side of wafer flatness and how this residue was reduced by a new developed clean.
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