Glass reflow process for an electrical isolation and temporary support of two-dimensional microscanner

Abstract

In a two-dimensional (2-D) electrostatic microscanner, electrical isolation for separating the current paths of the 2-D actuator and temporary support for enhancing the reliability of the scanner fabrication are still major issues. In this paper, a glass reflow process was proposed to achieve both electrical isolation and temporary support. The glass was successfully reflowed into the silicon trenches with various widths (15 μm, 25 μm and 35 μm) and lengths (25 μm, 50 μm and 100 μm), which will be also evaluated in terms of breakdown voltage and fabrication yield.