Development of UV stable LED encapsulants

Chih-Hau Lin, H. Li, Shu-Chen Huang, Chia-Wen Hsu, Kai-Chi Chen, Wen-Bin Chen
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引用次数: 5

Abstract

In recent years, high power white LED devices (LEDs) have been developed and widely used in display, display backlight module and general lightings. UV LED pumped RGB phosphors is one of the methods to generate white light. It shows some advantages, such as: excellent color rendering index (CRI), tolerant to LED variation, etc. However, the high energy of UV or near UV based LED lighting source leads to encapsulated transparent epoxy resin chain scission and forms some chromatic sites. The discolored epoxy materials decreases the light output and accumulates heat inside to speed up material degradation. Moreover, LED display and LED lighting devices also suffer UV irradiation from sunlight in the outdoor applications. In order to avoid the UV-degraded problem of LED encapsulating materials, we developed UV resistant material technology. Our developing strategies included evaluating UV stabilizer, synthesis of silicone modified epoxy or curing agent to enhance the bonding energy of encapsulating material.
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UV稳定LED封装剂的研制
近年来,高功率白光LED(发光二极管)设备开发和广泛应用于显示屏、显示器背光模块和通用照明。紫外LED泵浦RGB荧光粉是产生白光的方法之一。它表现出优异的显色指数(CRI),对LED变化的容忍度等优点。然而,紫外或近紫外LED光源的高能量导致封装的透明环氧树脂链断裂,形成一些色块。变色的环氧树脂材料减少了光输出,并在内部积累热量,加速了材料的降解。此外,LED显示屏和LED照明设备在户外应用中也会受到阳光的紫外线照射。为了避免LED封装材料的紫外线降解问题,我们开发了抗紫外线材料技术。我们的发展策略包括评估紫外线稳定剂,合成有机硅改性环氧树脂或固化剂来提高封装材料的键合能。
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