Vertical InAs nanowire MOSFETs with IDS = 1.34 mA/µm and gm = 1.19 mS/µm at VDS = 0.5 V

Karl‐Magnus Persson, Martin Berg, M. Borg, Jun Wu, Henrik Sjöland, E. Lind, L. Wernersson
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引用次数: 8

Abstract

III-V MOSFETs are currently considered for extension of, or as an add-on to, the Si CMOS technology. Following the Si-technology evolution, it is attractive to consider advanced III-V transistor architectures with non-planar geometry and improved electrostatic control. We report on vertical InAs single nanowire FETs with diameter of 45 nm diameter, integrated on Si substrates with LG = 200 nm. The devices demonstrate normalized extrinsic gm and IDS of 1.34 S/mm and 1.19 A/mm, respectively, at a VDS of 0.5 V, and with an onresistance of 321 Ωμm, all values normalized to the circumference. The main performance limitation is identified as the drain resistance in the ungated top part of the wire. By scaling the NW diameter to 28 nm, we also observe subthreshold swing down to 80 mV/decade at 50 mV VDS. However, the on-resistance increases for the narrow wires to 75 kΩμm, and the normalized current level is reduced as compared to the larger diameter wires.
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垂直InAs纳米线mosfet,在VDS = 0.5 V时,IDS = 1.34 mA/µm, gm = 1.19 mS/µm
III-V型mosfet目前被认为是Si CMOS技术的扩展或附加组件。随着si技术的发展,考虑具有非平面几何形状和改进静电控制的先进III-V晶体管架构是有吸引力的。我们报道了直径为45 nm的垂直InAs单纳米线场效应管,集成在LG = 200 nm的Si衬底上。在VDS为0.5 V时,器件的归一化外部gm和IDS分别为1.34 S/mm和1.19 A/mm,导通电阻为321 Ωμm,所有值都归一化到周长。主要的性能限制是确定在电线的非门控顶部漏阻。通过将NW直径缩放到28 nm,我们还观察到在50 mV VDS下亚阈值振荡降至80 mV/ 10年。然而,窄线的导通电阻增加到75 kΩμm,与直径较大的线相比,归一化电流水平降低。
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