Guarding trace and ground via-hole analysis for DDR interface designed in high-speed packages

R. Sung, K. Chiang, J. Lai, Yu-Po Wang
{"title":"Guarding trace and ground via-hole analysis for DDR interface designed in high-speed packages","authors":"R. Sung, K. Chiang, J. Lai, Yu-Po Wang","doi":"10.1109/IMPACT.2009.5382159","DOIUrl":null,"url":null,"abstract":"Because of the miniaturization on the demand, the area for the layout design is decreasing. But, more and more functions are integrated. In this situation, high-speed design, for example, the DDR access interface is easy to cause Simultaneous Switching Noises (SSN). In this paper, some analysis on this design was evaluated.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"14 1","pages":"136-139"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382159","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Because of the miniaturization on the demand, the area for the layout design is decreasing. But, more and more functions are integrated. In this situation, high-speed design, for example, the DDR access interface is easy to cause Simultaneous Switching Noises (SSN). In this paper, some analysis on this design was evaluated.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
高速封装中DDR接口的保护走线和接地过孔分析
由于需求的小型化,布局设计的面积越来越小。但是,越来越多的函数被集成。在这种情况下,高速设计(如DDR接入接口)容易产生SSN (Simultaneous Switching noise)。本文对该设计进行了分析评价。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Estimation design of MEMS-based inertial navigation systems with noise coupling input saturation: Robust approach Experimental investigation and finite element analysis of bump wafer probing Optimum design of contact springs used in registered jack connectors Optimization design of cup-shaped copper heat spreaders for high-power InGaN/sapphire LEDs The high performance electrodeposited copper foil for next generation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1