Chitosan-silica- polyethylene Glycol (Ch/Si/P) Solid Membrane for Removal of Cu(II), Zn(II) and Cd(II) Ions from Aqueous Solutions

F. W. Mahatmanti, E. Kusumastuti, W. D. P. Rengga, Nuryono, D. Siswanta
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引用次数: 1

Abstract

Chitosan is interestingly thought to be used as raw material to make membrane for it has functional group of –NH2 and –OH that is easy to modify. Chitosan membrane has weakness like low mechanical properties. To overcome those weaknesses, silica is added on chitosan membrane synthesis to improve chitosan membrane stability. In membrane synthesis process, plasticizer is used to improve mechanical properties, maintain integrality, and avoid holes and crackness. Polyethylene Glycol plasticizer addition is expected to increase physical and mechanical properties and hydrophilic properties on membrane surface significantly therefore metal ion solution can easily diffuse through chitosan-silica-PEG membrane. In this research, it is done chitosan-silica-PEG (Ch/Si/P) membrane synthesis with tetraethyl orthosilicate (TEOS) that is used as silica source then the membrane is used as adsorbent for ion Cu(II), Zn(II) and Cd(II) by batch method. Research shows that adsorption with batch method to all membranes is optimum pH for metal ions Cu(II) and Zn(II) = 6, Cd(II) = 5.5. Adsorption for ions Cu(II), Zn(II) and Cd(II) in membrane tends to follow Langmuir isotherm model. Generally, it can be said that Ch membrane ability on all adsorption metal ions increases with silica or PEG addition. Adsorption capacity value for Ch/Si/P membrane in \(\mu\)mol/g for ion Cu(II), Zn(II) and Cd(II) in order are 262, 183, and 107 \(\mu\)mol/g. Generally, in adsorption kinetic data there is a tendency of coefficient score of R2 linearity that is higher in the second order of pseudo kinetic model.
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壳聚糖-二氧化硅-聚乙二醇(Ch/Si/P)固体膜去除水溶液中的Cu(II)、Zn(II)和Cd(II)离子
壳聚糖具有易于修饰的-NH2和-OH官能团,因此被认为是制备膜的原料。壳聚糖膜具有力学性能低的缺点。为了克服这些缺点,在壳聚糖膜合成中加入二氧化硅来提高壳聚糖膜的稳定性。在膜合成过程中,增塑剂的使用是为了提高膜的力学性能,保持膜的完整性,避免膜出现孔洞和裂纹。聚乙二醇增塑剂的加入有望显著提高膜表面的物理力学性能和亲水性,因此金属离子溶液可以很容易地通过壳聚糖-硅- peg膜扩散。本研究以正硅酸四乙酯(TEOS)为硅源合成壳聚糖-二氧化硅-聚乙二醇(Ch/Si/P)膜,并采用间歇法将其作为Cu(II)、Zn(II)和Cd(II)离子的吸附剂。研究表明,对Cu(II)和Zn(II) = 6, Cd(II) = 5.5的金属离子,采用间歇吸附法在各膜上吸附的最佳pH值为:膜对Cu(II)、Zn(II)和Cd(II)离子的吸附遵循Langmuir等温模型。一般来说,Ch膜对所有金属离子的吸附能力随着二氧化硅或PEG的加入而提高。Ch/Si/P膜对Cu(II)、Zn(II)和Cd(II)离子的吸附容量值依次为262、183和107 \(\mu\) mol/g (\(\mu\) mol/g)。一般来说,在吸附动力学数据中,二级拟动力学模型的R2线性系数得分有较高的趋势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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