Chemical Mechanical Planarization of Ruthenium with Oxone as Oxidizer

S. N. Victoria, J. Jebaraj, I. Suni, S. Ramanathan
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引用次数: 27

Abstract

Potassium peroxymonosulfate (Oxone) was investigated as an oxidizing agent in silica based slurries for chemical mechanical planarization of Ru. Upon addition of oxone, the Ru removal rate increases significantly in the pH range of 1‐6. The slurry stability is poor at pH 3 and higher. At pH 2, oxone enhances the Ru removal rate even in the absence of abrasive, indicating that a soft film is formed on the Ru surface. Ru dissolution experiments show that the static etch rate is low. The Ru removal rate variation with pressure and velocity does not follow the Preston equation.
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氧酮氧化钌的化学机械刨平
研究了过氧单硫酸氢钾(Oxone)作为氧化硅基浆料化学机械平化Ru的氧化剂。在1 ~ 6的pH范围内,氧酮的加入显著提高了Ru的去除率。浆液在pH为3或更高时稳定性较差。在pH为2时,即使在没有磨料的情况下,氧酮也能提高Ru的去除率,这表明在Ru表面形成了一层软膜。Ru溶解实验表明,静态腐蚀速率较低。Ru去除率随压力和速度的变化不符合Preston方程。
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来源期刊
Electrochemical and Solid State Letters
Electrochemical and Solid State Letters 工程技术-材料科学:综合
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