C. Méndez, C. Louis, S. Paquay, P. De Vincenzo, I. Klapka, V. Rochus, F. Iker, N. André, J. Raskin
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引用次数: 0
Abstract
In this paper we present out-of-plane 3D self assembled SOI (silicon-on-insulator) MEMS that can be directly integrated to the electronic components. Because of their 3D nature, these structures can be used, for instance, as the basic elements for the construction of thermal actuators or flow sensors. We make a description of the fabrication and operation of these devices and we show how these two stages can be numerically simulated
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