{"title":"NUMANA: A hybrid numerical and analytical thermal simulator for 3-D ICs","authors":"Yu-Min Lee, T. Wu, Pei-Yu Huang, C. Yang","doi":"10.7873/DATE.2013.282","DOIUrl":null,"url":null,"abstract":"By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.","PeriodicalId":6310,"journal":{"name":"2013 Design, Automation & Test in Europe Conference & Exhibition (DATE)","volume":"23 1","pages":"1379-1384"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Design, Automation & Test in Europe Conference & Exhibition (DATE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7873/DATE.2013.282","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
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