E. Nogueira, A. Fernandez, A. Flórez, R. A. Santos, E. Mino
{"title":"Accelerated life tests of lead free solder alloys in presence of distilled water","authors":"E. Nogueira, A. Fernandez, A. Flórez, R. A. Santos, E. Mino","doi":"10.1109/CDE.2013.6481389","DOIUrl":null,"url":null,"abstract":"The Restriction of Hazardous Substances (RoHS) in electronic equipment imposed by legal considerations does not allow the manufacture of electronic equipments with alloys containing lead. As an ecological alternative, it can be used lead free alloys. Electrochemical migration is a reliability problem in printer circuit boards in high humidity environments. In this paper, the electrochemical migration of one solder that contains lead (Sn36Pb2Ag) and two lead free solder alloys (5n3.5Ag and Sn3.8Ag0.7Cu) were analyzed under presence of distilled water. It was analyzed the failure distribution times of three different types of solder pastes, with three voltages, and three strip spacing. Lead free solder pastes are more reliable than paste that contains lead. Exponential- Weibull model was the more adequate for the test results.","PeriodicalId":6614,"journal":{"name":"2013 Spanish Conference on Electron Devices","volume":"38 1","pages":"249-252"},"PeriodicalIF":0.0000,"publicationDate":"2013-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Spanish Conference on Electron Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CDE.2013.6481389","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The Restriction of Hazardous Substances (RoHS) in electronic equipment imposed by legal considerations does not allow the manufacture of electronic equipments with alloys containing lead. As an ecological alternative, it can be used lead free alloys. Electrochemical migration is a reliability problem in printer circuit boards in high humidity environments. In this paper, the electrochemical migration of one solder that contains lead (Sn36Pb2Ag) and two lead free solder alloys (5n3.5Ag and Sn3.8Ag0.7Cu) were analyzed under presence of distilled water. It was analyzed the failure distribution times of three different types of solder pastes, with three voltages, and three strip spacing. Lead free solder pastes are more reliable than paste that contains lead. Exponential- Weibull model was the more adequate for the test results.
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