Early design stage thermal evaluation and mitigation: The locomotiv architectural case

Abstract

To offer more computing power to modern SoCs, transistors keep scaling in new technology nodes. Consequently, the power density is increasing, leading to higher thermal risks. Thermal issues need to be addressed as early as possible in the design flow, when the optimization opportunities are the highest. For early design stages, architects rely on virtual prototypes to model their designs' behavior with an adapted trade-off between accuracy and simulation speed. Unfortunately, accurate virtual prototypes fail to encompass thermal effects timescale. In this paper, we demonstrate that less accurate high-level architectural models, in conjunction with efficient power and thermal simulation tools, provide an adapted environment to analyze thermal issues and design software thermal mitigation solutions in the case of the Locomotiv MPSoC architecture.