{"title":"Electromagnetic induced heating for rapid thermal cycling of single SnAgCu solder joint in double substrates","authors":"Jibing Chen, B. An, Cong Li, Wei Guo, Yiping Wu","doi":"10.1109/ISAPM.2011.6105712","DOIUrl":null,"url":null,"abstract":"The thermal fatigue behavior of the solder joint treated by electromagnetic induced heating is investigated in the present study. The microstructures and compositions of solder joints were observed and analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray system (EDXS) respectively. An approach to rapid thermal cycles by high-frequency electromagnetic induction heating was also presented in terms of numerical simulation. It was found that rapid thermal cycle has an evident influence on the microstructure and IMC between SAC305 solder and Cu substrate. The results showed that there is a rimous cracks phenomenon in the microstructure of the solder balls after rapid thermal cycle. The results indicate that this method by local induction heating is feasible to investigate the thermal fatigue behaviors of solder joint. This method can also effectively improve the reliability of the electronic packaging devices.","PeriodicalId":6440,"journal":{"name":"2011 International Symposium on Advanced Packaging Materials (APM)","volume":"26 1","pages":"129-133"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Symposium on Advanced Packaging Materials (APM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2011.6105712","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
The thermal fatigue behavior of the solder joint treated by electromagnetic induced heating is investigated in the present study. The microstructures and compositions of solder joints were observed and analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray system (EDXS) respectively. An approach to rapid thermal cycles by high-frequency electromagnetic induction heating was also presented in terms of numerical simulation. It was found that rapid thermal cycle has an evident influence on the microstructure and IMC between SAC305 solder and Cu substrate. The results showed that there is a rimous cracks phenomenon in the microstructure of the solder balls after rapid thermal cycle. The results indicate that this method by local induction heating is feasible to investigate the thermal fatigue behaviors of solder joint. This method can also effectively improve the reliability of the electronic packaging devices.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
