Study of naphthalene epoxy resin for low CTE copper clad laminate

Abstract

The developing trend for the high performance electronic devices still focuses on light, thin, short and small exhibiting high heat resistance and multifunctional properties. To meet the above requirements, the copper clad laminate substrate preferably produced from the materials having high thermal resistance, high glass transition temperature and low CTE. For the above purposes, we used 2,7-dihydroxynaphthalene tetra-function epoxy has a symmetrical molecular structure and high proportion of thermal stabilization naphthalene ring in our newly developed formulation for the production of CCL. When the 2,7-dihydroxynaphthalene epoxy is cured, it will import the CCL with excellent physical properties.