{"title":"A high throughput PMOS Source-Drain process optimized within FINFET architecture for high volume chip manufacturing","authors":"R. Mahadevapuram, V. Kaushal, A. Raviswaran","doi":"10.1109/ASMC49169.2020.9185252","DOIUrl":null,"url":null,"abstract":"Developed a novel multi-layered eSiGe film on FINFET architecture to increase PMOS performance by optimizing within wafer (WiW) uniformity for lateral growth and Boron concentration. The new process reduced growth related defect issues on large die products and excess abnormal growth defects to improve yield and reliability of latest semiconductor chips.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"18 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185252","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Developed a novel multi-layered eSiGe film on FINFET architecture to increase PMOS performance by optimizing within wafer (WiW) uniformity for lateral growth and Boron concentration. The new process reduced growth related defect issues on large die products and excess abnormal growth defects to improve yield and reliability of latest semiconductor chips.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
