J. M. Tsai, M. Daneman, B. Boser, D. Horsley, M. Rais-Zadeh, H. Tang, Yipeng Lu, O. Rozen, F. Liu, M. Lim, F. Assaderaghi
{"title":"Versatile CMOS-MEMS integrated piezoelectric platform","authors":"J. M. Tsai, M. Daneman, B. Boser, D. Horsley, M. Rais-Zadeh, H. Tang, Yipeng Lu, O. Rozen, F. Liu, M. Lim, F. Assaderaghi","doi":"10.1109/TRANSDUCERS.2015.7181409","DOIUrl":null,"url":null,"abstract":"We present the extension of the InvenSense fabrication platform to piezoelectric transduction. The newly proposed CMOS-MEMS Integrated Piezoelectric Platform inherits the wafer bonding advantages of its predecessor, leverages existing semiconductor infrastructure, and is applicable to a wide range of applications.","PeriodicalId":6465,"journal":{"name":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2015-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"34","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TRANSDUCERS.2015.7181409","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 34
Abstract
We present the extension of the InvenSense fabrication platform to piezoelectric transduction. The newly proposed CMOS-MEMS Integrated Piezoelectric Platform inherits the wafer bonding advantages of its predecessor, leverages existing semiconductor infrastructure, and is applicable to a wide range of applications.
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