The Semiconductor Trend From The Front-End View

M. Nagao
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Abstract

The external factors around the semiconductor has changed dynamically. The factors include the smartphone growth that had lead the market about decades has slowed down and the growth of the advanced technology needs for realizing the society using 5G and AI, constructing the datacenters to handle the huge data and the trade conflict between US and China etc. Toppan printings has covered the front-end business including leadframe, photmasks, OCF(On-chip colour filter) and FCBGA(Flip Chip Ball Grid Array) and have our own business forecast and the analysis. This paper will give you the analysis and the suggestion for the current situation of the semiconductor market and the forecast based on the view from the frontend semiconductor side.
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从前端看半导体趋势
围绕半导体的外部因素是动态变化的。这些因素包括引领市场几十年的智能手机增长放缓,实现使用5G和人工智能的社会的先进技术需求的增长,建设数据中心来处理巨大的数据以及中美之间的贸易冲突等。凸版印刷已涵盖前端业务,包括引线框架,光掩膜,OCF(片上彩色滤光片)和FCBGA(倒装芯片球栅阵列),并有我们自己的业务预测和分析。本文将基于前端半导体方面的观点,对半导体市场的现状进行分析和建议,并进行预测。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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