Study of Process Window Discovery Methodology for 28nm and Beyond Technology Node Process Window Limiting Structures

Xingdi Zhang, Hungling Chen, Yin Long, Kai Wang
{"title":"Study of Process Window Discovery Methodology for 28nm and Beyond Technology Node Process Window Limiting Structures","authors":"Xingdi Zhang, Hungling Chen, Yin Long, Kai Wang","doi":"10.1109/ASMC49169.2020.9185267","DOIUrl":null,"url":null,"abstract":"Process window limiting structures (PWLS) evaluated with process window discovery methodology (PWD) was studied on 28nm and beyond technology node wafers. Process window discovery methodology was innovated basing on process window qualification (PWQ) methodology. And the impacted factors, including focus energy matrix (FEM) wafer conditions, defects inspection conditions and defects filtering and sampling methods, were also investigated. With the innovated methodology, process window limiting structures were detected on 28nm wafers. Then the more reasonable process window target and spec, including lithography and etch process, were redefined. Furthermore, the process window limiting structures were enhanced monitored with Nano-point function of bright-field inspection system. Instead of end of line (EoL) chip probe (CP) test, inline process window discovery methodology has much time advantage for process window evaluation and process window limiting structures definition even monitoring.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"35 1","pages":"1-8"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185267","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Process window limiting structures (PWLS) evaluated with process window discovery methodology (PWD) was studied on 28nm and beyond technology node wafers. Process window discovery methodology was innovated basing on process window qualification (PWQ) methodology. And the impacted factors, including focus energy matrix (FEM) wafer conditions, defects inspection conditions and defects filtering and sampling methods, were also investigated. With the innovated methodology, process window limiting structures were detected on 28nm wafers. Then the more reasonable process window target and spec, including lithography and etch process, were redefined. Furthermore, the process window limiting structures were enhanced monitored with Nano-point function of bright-field inspection system. Instead of end of line (EoL) chip probe (CP) test, inline process window discovery methodology has much time advantage for process window evaluation and process window limiting structures definition even monitoring.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
28nm及以上工艺节点制程窗口限制结构制程窗口发现方法研究
在28nm及以上工艺节点晶圆上,采用工艺窗口发现方法(PWD)对工艺窗口限制结构(PWLS)进行了评价。在过程窗口限定方法的基础上,对过程窗口发现方法进行了创新。研究了焦点能量矩阵(FEM)晶片条件、缺陷检测条件、缺陷滤波和采样方法等影响因素。利用创新的方法,在28nm晶圆上检测了工艺窗口限制结构。然后重新定义了更合理的工艺窗口目标和规格,包括光刻工艺和蚀刻工艺。此外,利用光场检测系统的纳米点函数对工艺窗口限制结构进行了增强监测。内联进程窗口发现方法在进程窗口评估、进程窗口限制结构定义甚至监控等方面具有时间优势,可以代替行末芯片探针(CP)测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Systematic Missing Pattern Defects Introduced by Topcoat Change at PC Lithography: A Case Study in the Tandem Usage of Inspection Methods Computational Process Control Compatible Dimensional Metrology Tool: Through-focus Scanning Optical Microscopy Characterization of Sub-micron Metal Line Arrays Using Picosecond Ultrasonics An Artificial Neural Network Based Algorithm For Real Time Dispatching Decisions A Framework for Semi-Automated Fault Detection Configuration with Automated Feature Extraction and Limits Setting
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1