The influence of the top and the bottom grain boundaries on the current transport in YBa2Cu3O7-δ step-edge Josephson junction

F Lombardi , Z.G Ivanov, P Komissinski , G.M Fischer , P Larsson, T Claeson
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引用次数: 5

Abstract

We have studied the electrical transport properties of the grain boundaries (GBs) formed at the top and at the bottom edges of YBa2Cu3O7-δ step-edge Josephson junctions, for different values of the step angle α. The step-edge junctions were fabricated on (100) LaAlO3 steps using a tilted Ar ion milling. Due to the shadowing effect of the step, the middle and the bottom part of the step edge junction were contacted by thin stripes. We found that for α≈60° the top GB is responsible for the weak link behaviour of our step-edge junctions. On less steep steps, α≈45°, a series of GBs with weak link properties were found to nucleate along the step profile. We also correlated these results with the different microstructural properties of the GBs formed on steps with different angles.

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YBa2Cu3O7-δ阶边Josephson结中上下晶界对电流输运的影响
研究了不同阶跃角α值下YBa2Cu3O7-δ阶跃边Josephson结顶部和底部边缘晶界的电输运性质。采用倾斜氩离子铣削方法在(100)LaAlO3台阶上制备了台阶边缘结。由于台阶的阴影效应,台阶边缘连接处的中部和底部被细条纹接触。我们发现,当α≈60°时,顶部的GB负责我们的阶梯边结的弱连接行为。在较陡的α≈45°阶梯上,发现一系列具有弱连接性质的gb沿阶梯形核。我们还将这些结果与不同角度台阶上形成的GBs的不同显微结构特性联系起来。
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