A Design of Multi-Band Chip Antenna for Mobile Handsets

Journal of the Korean Institute of Electromagnetic Engineering and Science Pub Date : 2008-04-30 DOI:10.5515/KJKIEES.2008.19.4.477

In-Gui Cho, Jinwoo Jung, Cheonhee Lee, Yonghee Lee, Hyeonjin Lee, Yeongseog Lim

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Abstract

The paper introduces mobile handset multi-band chip antenna to be used on meander line PIFA structure and parasite patch. The proposed antenna uses an FR-4 substrate. The top layer is consist of meander lines PIFA structure to implement GSM900 and is connected with each rad and meander line on the via-hole for maximize space efficiency. The middle layer is designed with the signal line and gap to implement a DCS and PCS bands, the bottom layer which is added to a parasite patch on the ground can be show an adjust of frequency and impedance character by the connection of the radiators of middle layer and coupling. The fabricated antenna with the dimension of . The ground plane a dimension of , designed by a commercial software CST simulator. The experimental results show that the bandwidth for(VSWR) MHz in GSM900 band operation and 380() MHz in DCS, PCS band operation. The maximum gains of antenna are 0.25 dBi, 3.65 dBi and 3.3 dBi at resonance frequencies and it has omni-directional pattern practically.

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手机多波段芯片天线的设计

介绍了用于弯曲线PIFA结构和寄生贴片的手机多波段芯片天线。提出的天线使用FR-4基板。顶层由曲线PIFA结构组成，实现GSM900，并在过孔上与每条弧线和曲线相连，以最大限度地提高空间效率。中间层用信号线和间隙设计，实现DCS和PCS频段，底层在地面上加寄生片，通过中间层散热器的连接和耦合，实现频率和阻抗特性的调节。制作尺寸为的天线。地平面的一个尺寸，由商业软件CST模拟器设计。实验结果表明，GSM900频段工作带宽为(VSWR) MHz, DCS、PCS频段工作带宽为380()MHz。天线在谐振频率下的最大增益分别为0.25 dBi、3.65 dBi和3.3 dBi，实际具有全向方向图。

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Journal of the Korean Institute of Electromagnetic Engineering and Science

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审稿时长

3 weeks