A. Dasgupta, A. Alam, Guangqi Ouyang, SivaChandra Jangam, S. Iyer
{"title":"Antenna on Silicon Interconnect Fabric","authors":"A. Dasgupta, A. Alam, Guangqi Ouyang, SivaChandra Jangam, S. Iyer","doi":"10.1109/ectc32862.2020.00279","DOIUrl":null,"url":null,"abstract":"In this paper we demonstrate a 20 GHz patch antenna on the Silicon-Interconnect Fabric (Si-IF) platform. Two methodologies to integrate the antenna are explored in this paper. One is to embed a Fused Silica die inside a recess etched on the Si-IF. The second method is to compression mold Polydimethylsiloxane (PDMS) into the Si-IF recess. The antennas fabricated with both the methods are compatible with Ground- Signal-Ground (GSG) probing, and interfacing with off the shelf MMIC dies. Along with the process flow, we also present experimental characterisation of the fabricated antennas.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"31 1","pages":"1788-1794"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc32862.2020.00279","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this paper we demonstrate a 20 GHz patch antenna on the Silicon-Interconnect Fabric (Si-IF) platform. Two methodologies to integrate the antenna are explored in this paper. One is to embed a Fused Silica die inside a recess etched on the Si-IF. The second method is to compression mold Polydimethylsiloxane (PDMS) into the Si-IF recess. The antennas fabricated with both the methods are compatible with Ground- Signal-Ground (GSG) probing, and interfacing with off the shelf MMIC dies. Along with the process flow, we also present experimental characterisation of the fabricated antennas.
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