Simulation of Impact Rupture in Polysilicon Mems

A. Corigliano, F. Cacchione, A. Frangi, S. Zerbini
{"title":"Simulation of Impact Rupture in Polysilicon Mems","authors":"A. Corigliano, F. Cacchione, A. Frangi, S. Zerbini","doi":"10.1109/ESIME.2006.1643984","DOIUrl":null,"url":null,"abstract":"The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycrystal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture is simulated by means of cohesive traction-jumps softening laws; accidental drop is simulated through a simplified three-level multi scale approach","PeriodicalId":60796,"journal":{"name":"微纳电子与智能制造","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2006-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"微纳电子与智能制造","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ESIME.2006.1643984","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

The problem of impact rupture in polysilicon MEMS is addressed in this paper employing a numerical 2D geometrical model of the polycrystal obtained by means of a Voronoi tessellation coupled with a FE mesh. The intergranular and transgranular rupture is simulated by means of cohesive traction-jumps softening laws; accidental drop is simulated through a simplified three-level multi scale approach
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多晶硅Mems冲击破裂模拟
本文采用Voronoi镶嵌法和有限元网格法建立了多晶硅微机电系统的二维几何模型,研究了多晶硅微机电系统的冲击破裂问题。采用黏聚牵引-跳跃软化规律模拟了沿晶和穿晶破裂过程;采用简化的三层次多尺度方法对意外跌落进行了模拟
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